Nokia Corporation

Texas Instruments Corporation

Oxysure Systems Inc.

Texax Instruments Incorporated

Steven O Dunford

Mikko Aarras

Tetsuya Yamamoto

Jaakko Nousiainen

Takaharu Fujii

Jukka Rantala

Ramin Vatanparast

Pia Tanskanen

Juhani Lainonen

Julian T Ross

Scott Freeman

Steven Johnson

Tomas Cervenka

Martin Wieting

Provided herein is a composite layer including an electronically functional structural component adapted to integrate a plurality of electronic functions into a laminate cover, layer, and/or laminate component, for protecting, supporting, and/or forming a complete electronic device (such as a multimedia device). The composite layer includes a plurality of structural and/or protective layers interspersed with electronically functional layers or electronic components in communication with the multimedia device to form a supportive and electronically functional layer, cover, protective layer, and/or electronic device. Thus, the composite layer provided allow for the cost-effective addition of thin and lightweight functional, protective, and/or decorative layers to a multimedia device or other electronic device at a sales location or other customization location.

Composite layer for an electronic device

Chemical reaction activation plunger

A method is provided for manufacturing an electronically functional structural component adapted to integrate a plurality of electronic functions into a laminate cover, layer, and/or laminate component, for protecting, supporting, and/or forming a complete electronic device (such as a multimedia device). The method includes laminating a plurality of structural and/or protective layers interspersed with electronically functional layers or electronic components in communication with the multimedia device to form a supportive and electronically functional layer, cover, protective layer, and/or electronic device. Thus, the manufacturing methods provided allow for the cost-effective addition of thin and lightweight functional, protective, and/or decorative layers to a multimedia device or other electronic device at a sales location or other customization location.

Method for manufacturing a composite layer for an electronic device

A device and method for insuring the separation between a leadless chip carrier and printed wiring board, comprising aligning and attaching conductive pedestals to contact pads of either member and embedding the pedestals into the solder columns which are used to provide electrical connection. The conductive pedestals are comprised of an electrically conducting metal, solder, alloy or composite which will also provide thermal dissipation in selected designs.

Conductive pedestal on pad for leadless chip carrier (LCC) standoff

Growing community of inventors

Lewisville, TX, United States of America

Steven O Dunford