Lunar Energy, Inc.

Steven Nicholas Grolle

Peter H J How

Charles Ingalz

Stephen Robert Bannick

Andrew Diao

Mark Daniel Goldman

Kevin Richard Fine

Gargi Kailkhura

A cover is disclosed, including: a first gasket that is placed along a portion of the cover that is to join with a heat sink; a second gasket that is placed around a cutout region of the cover, wherein the cover is configured to couple to a circuit board associated with the power module and expose a component on the circuit board through the cutout region; and a fastener that is configured to engage with the heat sink.

Cover for sealing a power module

A system is including: an overmolded layer that is placed above a top surface and below a bottom surface of a circuit board, wherein the overmolded layer exposes at least communication interfaces on the circuit board and surrounds a heat generating component on the circuit board; a conductive layer that is placed over the overmolded layer on the top surface of the circuit board, wherein the conductive layer exposes the communication interfaces of the circuit board and covers the heat generating component on the circuit board; and wherein heat from the heat generating component is transferred into the conductive layer.

Thermal management system including an overmolded layer and a conductive layer over a circuit board

1. An inverter device is disclosed, including; an enclosure comprising a plurality of sides;

Antenna pass through module

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Mountain View, CA, United States of America

Steven Nicholas Grolle