Dallas Semiconductor Corporation

Maxim Integrated Products, Inc.

Steven N Hass

Michael L Bolan

Hal Kurkowski

Robert D Lee

Scott E Jones

Jeff A Gordon

Patrick Clement Strittmatter

Joseph P Hundt

Wendell L Little

Gary V Zanders

Stephen M Curry

Bradley M Harrington

Mark L Thrower

Nicholas M G Fekete

Ricky D Fieseler

James Walling

Steven N Grider

An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts. The alignment insensitive first and second electrical contacts may be electro-mechanically connected to corresponding contacts of an end-use equipment (e.g., a printer). Further, the integrated circuit package may be hosted by a peripheral device (e.g., a printer cartridge).

Single sided, flat, no lead, integrated circuit package

Single-sided, flat, no lead, integrated circuit package

Check valve package for pb-free, single piece electronic modules, the package having an exterior and an interior, and at least one electronic device mounted within the interior of the package electrically connected to a lead-free solder ball grid array on a surface of the package, the package having a check valve between the interior and exterior of the package configured to allow flow from the interior to the exterior and to prevent flow form the exterior to the interior. The package withstands the solder reflow temperatures for the reflow of the pb-free solder balls of a ball grid array packaging of an NVSRAM during mounting on a circuit board. The package is suitable for packaging circuits containing rechargeable batteries and for packaging other electronic devices.

Check valve package for PB-free, single piece electronic modules

Check valve package for Pb-free, single piece electronic modules

Integrated circuit package device comprising electrical contacts making solderless and bondless electrical-mechanical connection

Coin-shaped one-wire communication modules with a flange for mounting convenience may be attached to contact extensions on items such as work totes for ease of communication. A host computer can keep track and locate multiple items which have mounted communication modules with use of a single data line and a single ground line for all of the modules.

Electronic labeling systems and methods and electronic card systems and methods

Integrated circuit for identifying an item via a serial port

A metalization layer formed as part of a bump connection/flip chip process for a semiconductor circuit is also used to form a sense resistor or other passive components. The metalization layers normal composition can also be altered so as to change or control the value of the so formed resistor or to improve the temperature stability of the resistor. Other passive components such as capacitors or inductor can also be formed in this layer.

Integral bump technology sense resistor

Coin-shaped one-wire communication modules with a flange for mounting convenience may be attached to contact extensions on items such as work totes for ease of communication. A host computer can keep track and locate multiple items which have mounted communication modules with use of a single data line and a single ground line for all of the modules

Electronic labeling systems and methods and electronic card systems and

A secure electronic data module containing a monolithic semiconductor chip of the type having a memory that is protected by a combination of hardware and software mechanisms such that unauthorized access to the data stored in the memory is prevented. The monolithic semiconductor chip comprises a plurality of solder bumps for attaching the chip to a substrate that may be a printed circuit board or another chip; a multi-level interlaced power and ground lines using minimum geometries; and a detection circuit block for detecting an external trip signal that may be produced by a pre-specified change in an operating condition brought on by unauthorized accessing, or an internal trip signal that may be produced by shorting of power and ground lines or by a change in an oscillator's frequency, also associated with or appurtenant to unauthorized accessing of the secure memory.

Microcircuit with memory that is protected by both hardware and software

The present invention relates to mounting and adhesion systems and methods for compact electronic modules. More particularly, the present invention relates to an apparatus and technique for mounting an electronic module that is capable of communicating with an interface unit on a one-way-bus.

Module mounting and adhesion systems and methods for electronic modules

Growing community of inventors

Carrollton, TX, United States of America

Steven N Hass