Lsp Technologies, Inc.

The Boeing Company

Steven M Toller

Allan H Clauer

Jeff L Dulaney

David W Sokol

Craig Thompson Walters

Jeffrey L Dulaney

Mark E O'Loughlin

Richard Henry Bossi

David F Lahrman

Kevin Richard Housen

Patrick M Kenney

Nickolas K McCoy

Mark E O Loughlin

Ronald L Johnson

Kevin R Houson

Methods, systems, and apparatuses are disclosed for the protection of optical components used during laser bond inspection. In one embodiment, an optic surface wetting enhancement is provided on a protective optic to assist in forming a substantially flat film of transparent liquid from transparent liquid applied to a surface of a protective optic. A flat film of transparent liquid on a surface of a protective optic may be used to retain debris and effluent backscatter produced during a laser bond inspection process.

Protection of laser bond inspection optical components

Methods, systems, and apparatuses are disclosed for improving fatigue strength and damage tolerance of metal materials. For example, a system is provided for laser shock peening a metal material, the system comprising: a momentum trap material; a laser; an actuator, capable of pressing the momentum trap material into intimate contact with a first side of the metal material; and an advancer, capable of advancing the momentum trap material relative to the first side of the metal material.

Methods, systems, and apparatuses for laser shock peening metal materials

Systems and methods for the protection of optics are provided. In one example embodiment, a laser processing system is provided, the laser processing system comprising a laser source and an optic. The laser processing system may further comprise at least one of a liquid delivery mechanism configured to deposit liquid on the optic and an evacuation mechanism.

Optic protection via stagnant liquid film

Exemplary embodiments are disclosed for the use of Lamb waves in laser bond inspection.

Lamb waves for laser bond inspection

A diagnostic means to enable real-time inspection of bonded structures. The disclosed apparatus detects bond failure stress waves on-axis from the front side (beam application side). Pi-box and pi-rail EMAT gauges can be used with the disclosed apparatus. An inductively coupled EMAT may also be employed. An improved means to remotely deliver an interrogating laser beam to a surface is provided. The process head may utilize a water column or a water film. The water film process head may include the use of either a single water film or two spaced apart water films. The disclosed apparatus can be used with bonded composite structures, bonded structures using various materials, and to determine the dynamic strength of unbonded solid materials. The apparatus may also be used in other applications that require remote flexible delivery of a localized stress wave to a material and/or diagnosis of the resultant stress waves.

Apparatus and method for non-destructive testing

Methods, systems, and apparatuses are provided for creating bond delaminations in a controlled fashion within adhesively bonded structures. In one embodiment, a system for inducing a defect in a bond of a bonded article includes a laser and a laser processor head. The laser processor head includes a housing, a lens disposed within the housing, at least one magnet disposed within the housing, and at least one sensor disposed within the housing. The system is capable of applying a laser pulse of sufficient energy fluence to cause localized weaknesses in the bond.

Laser induced bond delamination

A method of manufacturing a workpiece involves performing any one of various post-processing part modification steps on a workpiece that has been previously subjected to laser shock processing. In one step, material is removed from the compressive residual stress region of the processed workpiece. Alternately, the workpiece may be provided with oversized dimensions such that the removal process removes an amount of material sufficient to generate a processed workpiece having dimensions substantially conforming to design specifications. Alternately, the material removal process is adapted to establish a penetration depth for material removal that coincides with the depth at which the workpiece exhibits maximum compressive residual stress. Alternately, a first high-intensity laser shock processing treatment is performed on the workpiece, followed by the removal of material from the compressive residual stress region, and then a second low-intensity laser shock processing treatment is performed on the workpiece. Material may be removed from the compressive residual stress region through a workpiece surface different from the laser shock processed surface. Material may also be deposited onto the laser shock processed surface.

Method of modifying a workpiece following laser shock processing

Tape overlays for use in laser bond inspection are provided, as well as laser bond inspection systems and methods utilizing tape overlays.

Tape overlay for laser bond inspection

A system for evaluating the integrity of a bonded joint in an article includes a laser configured in a laser shock processing arrangement to perform a laser shock processing treatment on the article. A beam delivery system employs an articulated arm assembly to communicate the radiant energy emitted by the laser to a process head proximate the article. The laser shock processing treatment causes the formation of shockwaves that propagate through the article, inducing internal stress wave activity that characteristically interacts with the bonded joint. A sensor detects a stress wave signature emanating from the article, which is indicative of the integrity of the bond. A detector such as a non-contact electromagnetic acoustic transducer provides a measure of the stress wave signature in the form of surface motion measurements.

Laser system and method for non-destructive bond detection and evaluation

Methods, systems, and apparatuses are provided for generation of focused stress waves that selectively apply tensile stress to local regions of a bonded article.

Laser bond inspection using annular laser beam

Various laser shock processing methods are provided to establish selective compressive residual stress distribution profiles within a workpiece. An asymmetrical stress distribution profile may be formed through the thickness of a thin section of a gas turbine engine airfoil. One method involves simultaneously irradiating a workpiece with a set of laser beams to form a corresponding set of adjacent non-overlapping laser shock peened surfaces, enabling the shockwaves to encounter one another. Additionally, opposite sides of the workpiece may be irradiated at different times to form opposing laser shock peened surfaces, enabling the shockwaves to meet at a location apart from the mid-plane. Furthermore, opposite sides of the workpiece may be irradiated simultaneously using laser beams having different pulse lengths to form opposing laser shock peened surfaces. Moreover, opposite sides of the workpiece may be irradiated simultaneously to form a set of laterally offset laser shock peened surfaces.

Growing community of inventors

Dublin, OH, United States of America

Steven M Toller