Google Inc.

Jds Uniphase Corporation

Intel Corporation

Steven M Swain

Douglas E Crafts

Kevin Y Yasumura

Jill Berger

David J Chapman

Takashi Nakamura

Suresh Ramalingam

James F Farrell

Kenzo Ishida

Hirofumi Ishida

Tianran Liang

Jyoti Kiron Bhardwaj

Robert Brainard

David J Dougherty

Sanjay M Thekdi

Zi-Wen Dong

Hiroaki Yamada

Anantharaman Vaidyanathan

Duane Cook

Jill D Berger

Mark Brian Farrelly

Thomas Nguyen

David Funk

David K Nakamoto

Erik W Egan

Niranjan Gopinathan

Yingchao Yan

An optical circuit switch including a two-dimensional fiber collimator includes a hole plate to hold and align a plurality of optical fibers. Fiber pathways within the hole plate can be formed using a femtosecond laser irradiation chemical etching (FLICE) technique. The use of the FLICE technique allows for extremely precise channels to be formed which allows for fibers to be aligned more closely with their intended alignment. The technique also allows for the channels or fiber pathways to be formed in a thicker material, which allows for greater structural support and robustness of the fiber collimator in use.

Glass fiber hole plates for 2D fiber collimators and methods for alignment and fabrication for optical switching applications

An apparatus and a camera system are provided. The apparatus includes an imaging screen configured to diffuse incoming light, and a lens system coupled to the imaging screen and configured to focus light from the imaging screen onto a CMOS image sensor. The imaging screen includes a ceramic diffuser layer fused into a surface of a glass substrate, and a thickness of the ceramic diffuser layer is within a range of about 7-10 &#x3bc;m.

Thin ceramic imaging screen for camera systems

A collimator device and a collimator lens array for an optical circuit switch are provided. The collimator includes a fiber array including multiple optical fibers disposed in a hole array. An optical lens array is aligned and coupled to the fiber array. A spacer is disposed between the fiber array and the optical lens array and provides substantially uniform spacing between lenses in the optical lens array and corresponding fibers in the fiber array. Multiple pads are positioned along edges of a surface of the spacer facing the optical lens array defining a first separation gap between the spacer and the optical lens array. A first epoxy bonds the spacer to the optical lens array, and a second epoxy bonds the spacer to the fiber array. The optical lens array includes a glass substrate having a first surface defining lenses in a two-dimensional array.

Optical circuit switch collimator

A planar lightwave circuit includes an arrayed waveguide grating (AWG), with input and output waveguides, partially curved array waveguides with respective length differences, and planar waveguide regions for focusing optical energy between the input/output and array waveguides. Optimal waveguide widths and spacing along the planar waveguide region facets are disclosed, which are largely determinative of AWG size and optical performance. Also disclosed are optimal cross-sectional waveguide dimensions (e.g., width and height); modified index of refraction difference between the waveguide core and cladding regions; and optimal array waveguide lengths, path length differences, and free spectral range. These features, especially when combined with advanced fiber attachment, passivation and packaging techniques, result in high-yield, high-performance AWGs (both gaussian and flattop versions).

Compact, low insertion loss, high yield arrayed waveguide grating

An optical component package, in which a transfer molded layer of material (e.g., syntactic foam in one embodiment) is formed at least partially around, or entirely around, the optical component to provide structural and thermal insulation around the component. The optical component may be a planar lightwave circuit (PLC), with a protective passivation layer formed between the PLC and the layer of syntactic foam, to de-couple stresses and thermal transfer between the PLC and the layer of syntactic foam. Strengthening caps, fiber assemblies, and a heater may be provided with the PLC assembly, around which the layer of syntactic foam can also be formed. The protective passivation layer can also be formed between these structures and the syntactic foam; in one embodiment between at least two strengthening caps formed on opposing edges of the PLC. The disclosed package provides numerous structural, thermal and size benefits.

Transfer molded packages with embedded thermal insulation

An optical component package, having an insulative buffer placed against the component, enclosing a first insulative cavity against a temperature-sensitive portion of the component. An outer package provides additional insulation for the component. The buffer may be formed of a soft insulative material, and pressed against the component by an inner surface of the outer package. For the PLC embodiments disclosed, the buffer is planar and includes a frame projecting from its perimeter toward the component to form the cavity. A heater may be positioned proximate the optical component to control its temperature, in which case a second buffer may be placed against the heater, enclosing a second insulative cavity against the heater, aligned with the temperature-sensitive portion of the component. The buffers and insulative cavities of the present invention provide important insulation for optical areas requiring precise temperature control for proper operation.

High thermal efficiency, small form-factor packages including thermally insulative cavities, and transfer molded variants

A cathode contact device is provided for providing particle deposition from an anode source onto a target surface of a working piece. The working piece has a first electrically conductive continuous contact surrounding the target surface. The cathode contact device includes a second electrically conductive continuous contact adapted for frictionally contacting the first contact along a continuous path located on the first contact. The second contact further has an inner periphery defining an aperture for passing therethrough the particles onto the target surface. Additionally, the cathode contact device includes a circuit for electrically coupling the second contact to an electrical current supply.

Flexible continuous cathode contact circuit for electrolytic plating of

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San Jose, CA, United States of America

Steven M Swain