Liebert Corporation

Vertiv Corporation

Steven M Madara

Stephen C Sillato

Thomas Harvey

Steven A Borror

Reasey J Mam

Franklin E Dipaolo

Zhiyong Lin

Benedict J Dolcich

Daniel J Schutte

Peter A Panfil

Graziano Galuppi

Daniel B Baer

David A Dukes

Robert C Pfleging

Franklin E DiPaolo

Steve Sillato

Thomas E Harvey

Stephen Sillato

The present disclosure relates to a power supply management system adapted for use with at least one utility proxy power source, to help control powering a load when an AC mains power source is not available to provide power to the load. The system has a power converter forming an uninterruptible power supply, and includes a controller configured to control operation of the power converter. A supplemental battery subsystem is included which is in communication with the power converter for supplying DC power to the power converter. The controller monitors the application of power from the utility proxy to the load and uses the DC power supplied by the supplemental battery subsystem, when needed, to supplement the generation of power by the power converter, to thus assist the power converter in powering the load along with the power being provided by the utility proxy.

Power supply management system and method for use with one or multiple different utility proxies

A cooling system has both pumped refrigerant economization and direct expansion cooling. When outside air temperature is low enough that pumped refrigerant economization can provide enough cooling to satisfy cooling demand, only pumped refrigerant economization cooling is used to provide cooling. When outside air temperature is low enough that pumped refrigerant economization can provide some but not all of the cooling needed to satisfy cooling demand, the pumped refrigerant economization is operated at one hundred percent capacity and the direct expansion cooling is operated at a capacity to provide any supplemental cooling that is needed. If the outside air temperature is high enough that pumped refrigerant economization cannot provide any cooling, then only direct expansion cooling is used to provide cooling.

Cooling system with direct expansion and pumped refrigerant economization cooling

A cooling system for transferring heat from a heat load to an environment has a volatile working fluid. The cooling system includes first and second cooling cycles that are thermally connected to the first cooling cycle. The first cooling cycle is not a vapor compression cycle and includes a pump, an air-to-fluid heat exchanger, and a fluid-to-fluid heat exchanger. The second cooling cycle can include a chilled water system for transferring heat from the fluid-to-fluid heat exchanger to the environment. Alternatively, the second cooling cycle can include a vapor compression system for transferring heat from the fluid-to-fluid heat exchanger to the environment.

Cooling system for high density heat load

The disclosure provides an improved cooling system and associated cabinet for electronic equipment, and optionally, a backup ventilation system for cooling related failures. Generally, the disclosure includes a high capacity closed loop refrigeration system in a modified cabinet, while accommodating standard sized computer equipment. Further, the system provides directed heat removal by altering typical airflow paths within the cabinet. The backup ventilation system is powered by auxiliary power in the case of power failure and uses the same fan(s) for ventilation as is used for cooling. The disclosure provides a more efficient, higher capacity cooling cabinet in less space than otherwise known in the art. Further, the cooling system can anticipate heat loads and therefore operate in a predictive capacity by monitoring input power to the electronic equipment and adjusting the cooling for the expected increase or decrease in heat load generated based on the input power.

Electronic equipment cabinet with integrated, high capacity, cooling system, and backup ventilation

A system for cooling heat-generating objects, such as computer boards situated in a rack, includes an enclosure in which the heat generating objects are situated. The enclosure has an air inlet and an air outlet, and a fan induces airflow into the air inlet, through the enclosure and out the air outlet. A heat exchanger is situated in the enclosure such that the heat exchanger is in a spaced apart relationship with the heat-generating object. Air moving through or past the heat-generating object is warmed, and the heat exchanger removes the heat before the air exits the enclosure.

Integrated heat exchangers in a rack for vertical board style computer systems

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Dublin, OH, United States of America

Steven M Madara