Delphi Technologies, Inc.

Delco Electronics Corporation

Steven Lee Davidson

Timothy Dean Garner

Andrew R Baker

Christopher David Combs

James O Anderson

Samuel Joseph Parr

Ronald Lee Anderson

Keith Kendell Roberts

Thomas Rezsonya

An air bag calibrator that is used to calibrate a plurality of seat sensors within a seat simultaneously. The calibrator uses controlled pressure contained within an air bladder and an air press cylinder to apply a controlled force across an entire seat surface that actuates all of the seat sensors in a consistent and repeatable manner, a major improvement over existing seat calibration methods. This is accomplished by loading a seat onto the calibrator, recording a baseline seat sensor value for each of the seat sensors, extending the air press cylinder to an extended position and applying a controlled force across the entire seat surface. The air pressure in the air bladder is then increased or decreased to a target pressure for a predetermined time, at which time an actuated seat sensor values for each of the seat sensors is recorded. A PODS controller in contained within the seat that is used for controlling the deployment of air bags in a crash situation is then calibrated as a function of the recorded baseline seat sensor values and the actuated seat sensor values.

Seat sensor calibration method and system

A vertical wafer compact flip chip feeder device includes a loading station for providing a loading location where a flip chip wafer having first and second planar surfaces is received such that the first and second planar surfaces are substantially perpendicular to a first plane. The flip chip feeder device further includes a pick-up station for providing a pick-up location where individual flip chips are retrieved from the flip chip wafer. A wafer translating assembly translates the flip chip wafer between the loading and pick-up stations with the first and second planar surfaces of the flip chip wafer remaining substantially perpendicular to the first plane. A chip pick-up assembly retrieves the individual flip chips from the flip chip wafer at the pick-up station and flips the individual flip chips to a flipped position such that first and second planar surfaces of the individual flip chips are substantially parallel with the first plane.

Flip-chip mounting assembly and method with vertical wafer feeder

Growing community of inventors

Carmel, IN, United States of America

Steven Lee Davidson