Dell Products Inc.

Steven L Williams

David William Grunow

Adolfo Sandor Montero

Qinghong He

James Utz

Gary S Thomason

Richard Worley

Leroy Jones, Jr

Satish Pratapneni

Jorge C Marcet

Marie-Pascale Chagny

Chase Berry

Qinghogn He

In one or more embodiments, one or more systems, one or more methods, and/or one or more processes may determine a temperature value within a chassis of an information handling system (IHS); may determine an ambient temperature value outside the chassis based at least on the temperature value within the chassis; may provide the ambient temperature value outside the chassis to a process executing on the IHS; may determine a threshold temperature value associated with at least one processor of the IHS based at least on the ambient temperature value outside the chassis and based at least on a target skin temperature value of the IHS; and may configure the at least one processor based at least on the threshold temperature value associated with the at least one processor.

System and method of configuring an information handling system based at least on an ambient temperature

Methods and systems for thermally managing data processing systems are disclosed. Data processing systems may provide computer implemented services to users thereof and/or other devices. The data processing systems may include various hardware components that perform computations used to provide the computer implemented services and may generate heat as a byproduct. To dissipate the heat generated by the hardware components, airflows proximate to the hardware components may be used to extract the heat. Once extracted, the heated airflows may be exhausted from the data processing systems. To facilitate use of the exhausted airflows, the airflows may be selectively directed in accordance with user preferences.

System and method for repurposing waste heat in computing devices

Angled eating utensil set

Electrical communication between an information handling system chassis having a non-conductive surface and processing components within the chassis is established through the non-conductive surface with conductive elements extending from a conductive pad. A protruding element extending from a conductive pad engages the conductive elements through the non-conductive surface when the protruding element is coupled to a cavity formed in the chassis. Alternatively, the protruding element extends from the chassis to couple to a cavity in the conductive pad. Processing components have electrical communication with the chassis through the conductive pad.

System and method for electrical communication through a non-conductive information handling system chassis surface

A connector includes a base and a connector member with a first end connected to the base and a second end opposite the first end. A first region on the connector member, located adjacent the first end, has a first impedance. A second region on the connector member, located adjacent the second end, has a second impedance greater than the first impedance. When an electro-statically charged device is connected to the connector, the electrostatic charge is dissipated relatively slowly due to initial contact with the second region of increased impedance, lowering the voltage resulting from the connection in order to protect static sensitive circuits coupled to the connector.

Progressive impedance connector

A technique for reducing electromagnetic interference (EMI) in electronic systems that provides a phase shift between signals having a common frequency component propagating on adjacent portions of circuit board signal traces. The phase shift is produced by a delay element in one of the adjacent signal traces. In one example, the delay element includes a serpentine delay located at the signal generating circuit side of the adjacent portion of the signal trace. Such a technique can be used to reduce EMI emissions from clock signals provided to RAM circuits of a system memory of a computer system.

Signal trace phase delay

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Round Rock, TX, United States of America

Steven L Williams