Intel Corporation

Steven L Pollock

Robert L Olivier

Ted T Honma

John G Oldendorf

Jeffrey W Day

Charles M Bailley

Andrew J Balk

Richard C Schaefer

Mike Lowe

Venting for component mounting pads of surface mount circuit boards allows the escape of gases from the junction between an electrical component and its associated mounting pad during soldering and facilitates a more complete and effective solder joint between the component base and pad. The venting may be accomplished by either one or more through holes in the board through the pads to allow undesirable gases to escape to the underside of the board, or by one or more solder free channels formed in the pad to allow the gases to escape through the periphery of the pad.

Gas venting component mounting pad

An ergonomic mouse is designed to maximize productivity by reducing user fatigue and discomfort. The ergonomic mouse of the present invention includes a housing having a grippable portion that permits a user to grip the mouse substantially under its palm when the mouse rests on a flat surface such as a mouse pad. A concave portion in the housing receives the user's fingers. At least one button is positioned in the concave portion of the housing. The at least one button is actuated by a substantially horizontal force produced by a substantially horizontal motion of the tips of the fingers as the fingers curl in toward the palm.

Ergonomic mouse

An apparatus is provided that includes a touch-sensitive three-dimensional globe and an information handling system coupled to the touch-sensitive three-dimensional globe and adapted to receive the signals corresponding to the touched area of the globe. The information handling system may include a display device to display information regarding the area. A data accessing system may be coupled to the information handling system and be adapted to receive signals from the information handling system and transmit information from a data storage unit to the information handling system.

Apparatus and method for obtaining geographical information using a touch-sensitive globe device

An apparatus, comprising a substrate having a surface, comprising an array of electrical contacts, and a plurality of electrical planes, where the plurality of electrical planes are positioned within the electrical contact array.

Efficient multiple power and ground distribution of SMT IC packages

The present invention is designed to test whether a Central Processing Unit (CPU) in a computer system is being overclocked. That is, being run at a speed higher than its rated or assigned speed. An important feature of the present invention is that it is internal to the computer system on which it operates. That is, the test of the present invention is implemented in the computer system's Basic Input/Output System or as microcode stored directly on the CPU. The end user need not resort to any external means such as a floppy or CD disk to test the CPU included in his/her computer system. If the CPU is not overclocked, the test runs invisible to the end user. If, on the other hand, the CPU is overclocked, the test allows the user to either continue with the normal boot up process or exit the boot up process to adjust the running speed to substantially match the assigned speed of the CPU.

SYSTEM TEST AND METHOD FOR CHECKING PROCESSOR OVER-CLOCKING BY RETRIEVING AN ASSIGNED SPEED FROM AN REGISTER INTERNAL TO THE PROCESSOR, COMPARING WITH RUNNING SPEED, AND DISPLAYING CAUTION MESSAGE TO USER

An improved packaged IC is disclosed, which includes a semiconductor die mounted to a substrate and an EMI shield that encapsulates the semiconductor die. In addition, a ground pin is electrically coupled to the semiconductor die, a ferrite bead is electrically coupled to the EMI shield and the ground pin, and a package body encapsulates the EMI shield.

Integrated circuit package with EMI shield

An electronic assembly that may include an elastomeric connector. The elastomeric connector may couple the solder ball of a BGA integrated circuit package to a substrate. The elastomeric connector provides an interconnect that may compensate for variations in the solder balls and a lack of flatness in the package and/or substrate.

PLGA-BGA socket using elastomer connectors

An improved packaged IC is disclosed, which includes a semiconductor die mounted to a substrate and an EMI shield that encapsulates the semiconductor die. In addition, a package body encapsulates the EMI shield.

A connector for mounting a processor card on a motherboard includes a base and an upper support chassis. The base is electrically and structurally coupled to a motherboard and the upper support chassis is mounted on the base. A processor card is received within the upper support chassis for mounting of the card to the motherboard. When the card is received within the upper support chassis, the processor card is positioned substantially parallel to the motherboard.

Growing community of inventors

Hillsboro, OR, United States of America

Steven L Pollock