Raytheon Company

Steven K Brierley

William E Hoke

Eduardo M Chumbes

Kelly P Ip

Dale M Shaw

A method for forming a structure on a surface of a semiconductor. The method includes: forming the material as a lower layer of the structure using a first deposition process to provide the lower layer with a first etch rate to a predetermined etchant; forming the upper layer of the structure with the material on the lower using a second deposition process to provide the upper layer with a second etch rate to the predetermined etchant higher than the first etch rate; and applying the predetermined etchant to upper layer to selectively remove the upper while leaving the lower layer.

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Westford, MA, United States of America

Steven K Brierley