Apple Inc.

Steven J Osborne

Adam T Garelli

Ian A Spraggs

William Francis Leggett

Marwan Rammah

Abhijeet Misra

William A Counts

Joss Nathan Giddings

Sarah J Montplaisir

Eric T Corriveau

Tyler J Ewing

Bradley Joseph Hamel

Simon Regis Louis Lancaster-Larocque

Peter N Jeziorek

Lauren M Farrell

Sunita Venkatesh

Rhett D Gentile

Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

Electronic device having a composite structure

A aesthetically appealing mounting system for an electronic device capable of forming a semi-conductive path for electro-static discharge. The mounting system can include an electrically conductive layer covered by a cosmetic anodized layer with multiple micro-perforations formed through the anodized layer exposing a small portion of the electrically conductive layer. The micro-perforations can be formed by laser-etching the cosmetic anodized layer to provide a grounding path while the micro-perforations remain visually undetectable. A semi-conductive wear layer can be configured to couple with the anodized layer. In some embodiments, the semi-conductive wear layer is in a recess on an electronic device. In some embodiments, the semi-conductive wear layer is comprised of a conformal conductive rubber.

Sparse laser etch anodized surface for cosmetic grounding

Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.

Techniques for joining one or more structures of an electronic device

The described embodiments relate generally to methods to form magnetic assemblies. In particular, extreme cold work (aka cold spray) is used to enhance magnetic properties of a steel alloy (most notably 316L stainless steel and others) that can then be formed into useful shapes and embedded within a substrate without undue machining operations.

Cold spray of stainless steel

Growing community of inventors

Sunnyvale, CA, United States of America

Steven J Osborne