Teradyne, Inc.

Steven Hauptman

Frank Parrish

Roya Yaghmai

A shielded cable interface module having cable receiving grooves extending laterally to an edge of the board, each including a center conductor groove, an insulator groove, and a shield groove. A center conductor via and a shield via extend through the board. A conductor plane on the cable termination side surrounds the cable receiving grooves. The conductor plane includes a non-conductor region within the conductor plane adjacent to each of the conductor center conductor grooves. Ground vias associated with the cable receiving grooves are spaced apart from and partially surround the center conductor via outside and adjacent to the non-conductor region, the ground vias extend through the printed circuit board from the cable termination side to the system interface side.

Shielded cable interface module and method of fabrication

An apparatus includes a circuit element that requires calibration, a calibration circuit for use in calibrating the circuit element, and a damping diode electrically connectable in a first path that includes the calibration circuit and electrically connectable in a second path that excludes the calibration circuit. The first path is for electrically connecting the calibration circuit and the circuit element, and the second path is for use in protecting the apparatus from electrostatic discharge. A switching circuit is used to switch the clamping diode between the first path and the second path.

Calibrating a tester using ESD protection circuitry

A printed circuit board assembly adapted for immersion cooling is disclosed. The assembly includes a first circuit board having a first device side with a first portion configured to mount a first plurality of semiconductor devices. A second circuit board having a second device side with a second portion configured to mount a second plurality of semiconductor devices is disposed in confronting parallel relationship to the first circuit board. The assembly further includes a border element interposed between the first and second boards and disposed around the respective first and second portions. The border element cooperates with the first and second boards to form a liquid-tight container. An inlet formed in the border receives an electrically nonconducting liquid that is subsequently discharged through an outlet.

Printed circuit board assembly for automatic test equipment

In at least one embodiment, a circuit for a multi-channel tester having a central resource, a plurality of outputs, and a switching matrix coupling the central resource to the plurality of outputs via a plurality of selectable channels. Each of the selectable channels having PIN diodes coupled in a half-bridge configuration. A first, a second, and a third biasing source for forward biasing the PIN diodes. The first and second biasing sources are coupled to a central resource coupled end and an output coupled end of the half-bridge, respectively. The third biasing source is coupled to a common node. The first and second biasing sources are constructed to provide substantially balanced outputs and such that the sum of the outputs of the first and second biasing sources are substantially balanced with respect to the output of the third bias source. In some embodiments, a the plurality of selectable channels comprises the same first biasing source. In some embodiments, each of the plurality of channels comprises a different second biasing source. In some embodiments, pin electronics drivers can be used as the second biasing source. In some embodiments, a single third biasing source can be coupled to each of the common nodes of the plurality of selectable channels via one of a plurality of switches. In some embodiments, the PIN diodes can be located near the central resource end of the channel and near the output pin end of the channel allowing cleaner more accurate voltage/timing measurements.

Circuit for improved test and calibration in automated test equipment

An apparatus for testing and calibration in automated test equipment includes a time varying signal channel having a series-connected solid state switch interposed between a time varying signal circuit end and a device under test end of the time varying signal channel. A DC test channel is connected to the time varying signal channel between the series-connected solid state switch and the device under test end, and has at least one solid state switch interposed along the DC test channel to provide switchable coupling between a DC parametrics circuit side of the DC test channel and the time varying signal channel. A time varying signal level calibration channel is connected to the time varying signal channel between the series-connected solid state switch and the time varying signal circuit end, and has at least one solid state switch interposed along the signal level calibration to provide switchable coupling between a DC parametrics circuit side of the signal level calibration channel and the time varying signal channel. The time varying signal channel may have a low resistance type solid state switch, while the DC test channel, the signal level calibration channel, or both, may have low capacitance type solid state switches. Thus, opto-coupled MOSFETS, pin diodes, or other kind of solid state switches, may be utilized. The DC test channel, or the signal level calibration channel, or both, may have a force branch and a sense branch each having a solid state switch.

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Camarillo, CA, United States of America

Steven Hauptman