Innovative Micro Technology

Fidelica, Microsystems, Inc.

Luxtera, Inc.

Steven H Hovey

John Stuart Foster

Paul Rubel

Hung P Nguyen

Shiva Prakash

Randolph S Gluck

Attila Mekis

Christopher S Gudeman

Steffen Gloeckner

Richard Thomas Martin

Michael Mack

John Harley

Peng Sun

Srinavasan K Ganapathi

Srinivasan K Ganapathi

Gregory A Carlson

Kimon Rybnicek

Ian R Johnston

Methods and systems for coupling a light source assembly to an optical integrated circuit are disclosed and may include a system comprising a laser source assembly having a laser, a rotator, and a mirror, where the laser source assembly is coupled to a die including an angled grating coupler and a waveguide. The system may generate an optical signal utilizing the laser, rotate the polarization of the optical signal utilizing the rotator, reflect the rotated optical signal onto the grating coupler on the die, and couple the optical signal to the waveguide, where an angle between a grating coupler axis that is parallel to the waveguide and a plane of incidence of the optical signal reflected to the angled grating coupler is non-zero. The angle between the grating coupler axis and the plane of incidence of the optical signal reflected to the angled grating coupler may be 45 degrees.

Method and system for coupling a light source assembly to an optical integrated circuit

A micromechanical pumping system is formed on a substrate surface. The pumping system uses a pumping element which pumps a fluid through valves which move in a plane substantially parallel to the substrate surface. An electromagnetic actuating mechanism may also be fabricated on the surface of the substrate. Magnetic flux produced by a coil around a permeable core may be coupled to a permeable member affixed to a pumping element. The permeable member and pumping element may be configured to move in a plane parallel to the substrate. The electromagnetic actuating mechanism gives the pumping system a large throw and substantial force, such that the fluid pumped by the pumping system may be pumped through a transdermal cannula to deliver a therapeutic substance to the tissue underlying the skin of a patient.

In-plane electromagnetic MEMS pump

A material for bonding a first wafer to a second wafer, which includes an insulating adhesive with conductive particles embedded in the adhesive substance. When the adhesive is applied and melted or fused, and pressure is applied between the first wafer and the second wafer, the first wafer approaches the second wafer until a minimum separation is reached, defined by a dimension of the conductive particles. Each of the first wafer and the second wafer may have circuitry formed thereon, and the conductive particles may form a conductive path between the circuitry on one wafer and the circuitry on the other wafer. Advantageously, the high fusing temperature required by the insulating adhesive may also serve to activate a getter material, formed in the device cavity between the first wafer and the second wafer.

Wafer bonding material with embedded conductive particles

A system and a method are described for forming features at the bottom of a cavity in a substrate. Embodiments of the systems and methods provide an infrared transmitting, hermetic lid for a microdevice. The lid may be manufactured by first forming small, subwavelength features on a surface of an infrared transmitting substrate, and coating the subwavelength features with an etch stop material. A spacer wafer is then bonded to the infrared transmitting substrate, and a device cavity is etched into the spacer wafer down to the etch stop material, exposing the subwavelength features. The etch stop material may then be removed, and the microdevice enclosed in the device cavity, by bonding the device wafer to the lid.

Lid structure for microdevice and method of manufacture

A device and a method are described which hermetically seals at least one microstructure within a cavity. Electrical access to the at least one microstructure is provided by through wafer vias formed through a via substrate which supports the at least one microstructure on its front side. The via substrate and a lid wafer may form a hermetic cavity which encloses the at least one microstructure. The through wafer vias are connected to bond pads located outside the cavity by an interconnect structure formed on the back side of the via substrate. Because they are outside the cavity, the bond pads may be placed inside the perimeter of the bond line forming the cavity, thereby greatly reducing the area occupied by the device. The through wafer vias also shorten the circuit length between the microstructure and the interconnect, thus improving heat transfer and signal loss in the device.

Interconnect structure using through wafer vias and method of fabrication

A micromechanical particle sorting chip uses an actuator divided into two parts to direct a component of interest into one of a plurality of possible exit paths, based on detection of a fluorescent signal emanating from the component of interest. The two-part actuator may include a force-generating portion and a microactuator portion. The microactuator portion may be disposable, whereas the force-generating portion may be reuseable. By bringing the force-generating portion into proximity to the microactuator portion, the microactuator is induced to move, thereby separating the component of interest from the rest of the fluid stream. The force-generating portion and the microactuator portion may be optimized and fabricated separately, thereby leading to faster, more reliable and less expensive particle sorting.

MEMS actuator and method of manufacture for MEMS particle sorting device

A micromechanical particle sorting chip uses laser light directed through at least one of a reflective and refractive surface to come to a focus in an optically transparent layer. The laser light impinges on a particle of interest, causing it to fluoresce. Upon detecting the fluorescence, a micromemchanical actuator is activated, which directs the particle of interest into one of a plurality of possible exit paths.

Method and apparatus for sorting particles with a MEMS device

The present invention provides a pressure sensing device that includes at least one TMR sensor, and preferably an array of TMR sensors, with each TMR sensor having an insulating spacer layer interposed between a pinned and a free ferromagnetic layer. In an unbiased state, the magnetization vector of each of the ferromagnetic layers is preferably parallel to each other. Upon application of a small voltage, the magnetization vectors remain unchanged. Upon application of stress, the magnetization vector of the free magnetic layer will rotate, thus causing a corresponding and proportionally related change in the resistance of the sensor. This change in resistance can be sensed and used to calculate the stress applied thereto.

Use of multi-layer thin films as stress sensors

The present invention provides a pressure based fingerprint image capture device that includes an array of cantilevers or simply suspended bridges, with each pressure based sensor having a cantilever or a simply suspended bridge in contact with a conducting electrode that deforms under the load applied by the localized ridge on the fingerprint, and which provides contact to another conducting electrode thereby closing the electrical circuit, a switch in the simplest form, and providing a &ldquo;pulse&rdquo; response from the sensor. In the quiescent state, each cantilever or simply suspended bridge structure contains an upper electrode which forms one part of the switch, while another conducting layer, the lower electrode at the bottom of the well of the individual sensor, forms the other part of the switch.

Growing community of inventors

Santa Barbara, CA, United States of America

Steven H Hovey