Infineon Technologies Ag

Steven Gross

Horst Theuss

Mathias Vaupel

Helmut Wietschorke

Markus Loehndorf

Stephan Schmitt

Matthias Boehm

James Sterling

A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.

Pressure sensor module having a sensor chip and passive devices within a housing

Some embodiments of the present disclosure relate to improved package assemblies for pressure sensing elements. Rather than leaving a pressure sensing element unabashedly exposed to the ambient environment in a manner that makes it susceptible to damage from stray wires, dirt, and the like; the improved package assemblies disclosed herein include a cover that helps form an enclosure around the pressure sensing element. The cover includes a fluid-flow channel with a blocking member arranged therein. The fluid-flow channel puts the pressure sensing element in fluid communication with the external environment so pressure measurements can be taken, while the blocking member helps protect the pressure sensing element from the external environment (e.g., stray wires and dirt to some extent). In this way, the package assemblies disclosed herein help promote more accurate and reliable pressure measurements than previous implementations.

Integrated pressure sensor seal

Growing community of inventors

Northville, MI, United States of America

Steven Gross