Harris Corporation

Steven E Wilson

Walter M Whybrew

Gary A Rief

Donald J Beck

Brett A Pigon

James B Nichols

Kelly V Hillman

Ralph D DiStefano

James A Sanborn

Hector Deju

Robert J Guinn, Jr

Joseph W Priester

David M Holaday

Erik Granholm

Thomas K Buschor

A modular antenna architecture includes a plurality of joined-together flat, laminate-configured antenna sub-panels, in which RF signal processing (RF amplifier) modules are embedded within a very lightweight, honeycomb-configured support member, upon which respective antenna sub-array and control, power and beam steering signal distribution networks are respectively mounted. The thickness of the honeycomb-configured support member-embedded is sized relative to the lengths of the RF signal processing modules such that input/output ports at opposite ends of the RF modules are substantially coplanar with conductor traces on the front and rear facesheets, so that the RF modules provide the functionality of RF feed-throughs to provide RF signal coupling connections between the rear and front facesheets of the antenna sub-panel.

Lightweight antenna subpanel having RF amplifier modules embedded in

A thermosonic ribbon bonding process uses a combination of a relatively low temperature and a high frequency to bond a ribbon conductor to conductive bonding sites of a system level support structure, such as a space/airborne antenna, containing circuit components whose characteristics might otherwise be degraded at an elevated temperature customarily used in device-level thermosonic bonding processes. By relatively low temperature is meant a temperature no greater than the minimum temperature that would potentially cause a modification of the circuit parameters of at least one of the system's components. Such a minimum temperature may lie in a range on the order of 25-85.degree. C., while the ultrasonic bonding frequency preferably lies in a range of from 122 KHz to 140 KHz. For gold ribbon to gold pad bonds, this high frequency range achieves the requisite atomic diffusion bonding energy, without causing fracturing or destruction of the gold ribbon or its interface with the gold pad.

High frequency, low temperature thermosonic ribbon bonding process for

An interconnect laminate structure integrates RF and auxiliary (e.g. digital and D.C.) signalling capabilities in a common structure by means of a stacked conductor-plated dielectric configuration that facilitates access to and routing by channelline/waffleline RF transmission links and separate control (e.g. digital, power supply) links, without having to perform laborious manual routing tasks to effect auxiliary connectivity among the components of a network. The interconnect structure includes a first dielectric layer having a channel formed in a first surface thereof, the channel having a conductive surface and configured to accommodate the insertion of a dielectric coated conductor into the channel so as to form an RF transmission line. Second dielectric layers, each of which has a conductive layer formed on a first surface thereof, are mounted together with the first dielectric layer in a laminate assembly. Respective layers of adhesive are interleaved with the plurality of second dielectric layers together with the first dielectric layer in a laminate assembly.

Combined RF and digital/DC signalling interconnect laminate

A method of making a thin, lightweight and flexible RF waffleline includes the production of a negative silicone casting from a relatively thick and rigid metal positive tooling plate having the identical matrix of the desired waffleline and product. The waffleline is formed by casting an epoxy resin on the silicone casting or nickel electroforming, following by metallization. The waffleline end products is either a very thin and flexible epoxy composite structure or a nickel electroform metallized with gold. Accordingly, a negative WMA image can now be cast, as opposed to expensive machining or forming, with relatively simple and inexpensive techniques in fabricating the process tooling.

Lightweight, flexible waffleline interconnect structure and methods of

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Melbourne, FL, United States of America

Steven E Wilson