Palo Alto Research Center Inc.

Xerox Corporation

Palo Alto Research Corporation Incorporated

Steven E Ready

Ping Mei

William S Wong

Robert Anthony Street

Warren Bruce Jackson

Naveen Chopra

Gregory Lewis Whiting

Tse Nga Ng

Jurgen Hans Daniel

David Kalman Biegelsen

Raj B Apte

Kent J Evans

Peter Gordon Odell

Michael L Chabinyc

Eric Peeters

Timothy D Stowe

Ashish V Pattekar

David Eric Schwartz

Bryan James Roof

Alan G Bell

Ana Claudia Arias

Barkev Keoshkerian

Peter Kiesel

Jennifer Lynne Belelie

David Lyell Knierim

Bing R Hsieh

Eric J Shrader

Michelle Chretien

James B Boyce

Christopher A Paulson

Brent Shawhan Krusor

Gregory Joseph Kovacs

Karthik Gopalan

Andrew J Moore

Janos Veres

Stephen David White

Alberto Salleo

Sivkheng Kor

Lars-Erik Swartz

Uma Srinivasan

Lars Erik Swartz

David A Jared

Michael A Kneissl

Joerg Martini

Christopher A Wagner

Gregory J Kovacs

Terrance Lee Stephens

John Steven Paschkewitz

John Stuart Fitch

Michael D Thompson

Jing Zhou

Gregory B Anderson

Scott J Limb

Mark Teepe

Corie Lynn Cobb

Lawrence Floyd, Jr

Scott Jong Ho Limb

Yunda Wang

Scott J H Limb

Wei Hong

David Alan Tence

Yong Zhang

Kateri E Paul

Xiaodong Wu

Jonathan Rivnay

Norbert H Nickel

Allen W Denham

René A Lujan

James Fallon, Jr

Michael L Chebinyc

David Stephen White

Michael Thompson

A system for treatment of thread includes a weft thread printer having an intake positioned to receive a weft thread from a source, as well as an encoder that is configured to detect a length of the weft thread as the weft thread moves through the weft thread printer along a travel path. The system also includes a printhead positioned to apply coatings of a plurality of colors to the weft thread and yield a treated weft thread, as well as an outlet positioned to pass the treated weft thread to a loom.

Inkjet loom weaving machine

A system and method of printing on a strand element with a printer head. The printer head includes a conduit and a cavity formed within the conduit, wherein the cavity is configured to receive the strand element and pass the strand element from a first end of the cavity to a second end of the cavity. The printer head also includes a set of nozzles formed on the conduit and positioned on a perimeter of the cavity around a first target location within the cavity, wherein at least one of the nozzles is a fluid nozzle configured to dispense a fluid, and at least one of the nozzles is a vacuum nozzle configured to apply a vacuum force on the cavity.

Printer head for strand element printing

A system and method of printing on a strand element with a printer head. The printer head includes a conduit and a cavity formed within the conduit, wherein the cavity is configured to receive the strand element and pass the strand element from a first end of the cavity to a second end of the cavity. The printer head also includes a first set of fluid nozzles formed on the conduit and positioned on a perimeter of the cavity around a first target location within the cavity, wherein each of the fluid nozzles in the first set is positioned to aim at the first target location, and the first target location corresponds to a location of a first segment of the strand element when the strand element is positioned within the cavity.

Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among other configurations, to form electronic assemblies. The surface of the electronic circuit component carries electronic elements such as conductive traces and/or other configurations including contact pads. A method for forming an electronic assembly includes providing a tacky layer. Then an electronic circuit component is provided having a first side and a second side, where the first side carries the electronic elements. The first side of the electronic circuit component is positioned into contact with the tacky layer. A bonding material is then deposited to a portion of the adhesive layer that is not covered by the first side of the electronic circuit component, to a depth which is sufficient to cover at least a portion of the electronic circuit component. The bonding material is then fixed or cured into a fixed or cured bonding material, and the tacky layer is removed. By these operations, the electronic circuit component is held in a secure attachment by the fixed or cured bonding material, and circuit connections may be made.

Bare die integration with printed components on flexible substrate without laser cut

A printing apparatus includes a liquid ejector configured to eject liquid droplets towards a medium. A particle delivery device is configured to deliver particles to the medium. The particles are configured to combine with at least some of the liquid droplets and change at least one property of the liquid droplets. The particle delivery device is configured to deliver the particles after or substantially simultaneously as the liquid droplets are ejected. A curing device is configured to cure the combination of the liquid droplets and the particles onto the medium. A controller is configured to independently control the liquid ejector and the particle delivery device.

Dual particle inkjet printer

Development of smart objects with electronic functions requires integration of printed components with IC chips or dies. Conventional chip or die bonding including wire bonding, flip chip bonding, and soldering may not be applicable to chip or die attachment on low temperature plastic surfaces used in physical objects. Printing conductive connection traces requires a smooth interface between contact pads of a chip and the surface of the physical object. In order to address this issue of chip/die attachment to a physical object, this disclosure provides embodiments to construct a fixture on a chip or die for attachment and electrical connection onto a physical object by printing operations and/or ACF bonding methods.

Method and fixture for chip attachment to physical objects

A method and system utilizes ink jetting or printing of surface work function modification material or solution to form modified p-type and/or n-type electrodes. The proposed method is suitable for making complementary OTFT circuits in roll-to-roll fabrication environment.

Selective surface modification of OTFT source/drain electrode by ink jetting F4TCNQ

A method for creating controlled scattering effects including (a) disposing at least one curable ink layer onto a substrate in an imagewise fashion or in a continuous film fashion; (b) applying a first cure to partially cure the ink layer (a); (c) disposing at least one scattering material onto the ink layer (a); and (d) applying a second cure to fully cure the ink layer (a); wherein the first cure and the second cure are applied in a manner to control the disposition of the scattering material on top of and penetration into the curable ink layer to control surface and subsurface scattering properties.

Printing process for preparing controlled scattering effects

A system and method for treatment of thread includes a thread printer that applies colored coatings to thread. A camera is positioned to capture images of the treated thread after it passes through an outlet of the thread printer. The system processes the images to determine whether the location of a selected segment of the treated thread corresponds to an expected location. If the actual location of the selected segment corresponds to the expected location, the system will continue instructing the thread printer to selectively apply the colored coatings to the thread according to the pattern. However, if the actual location does not correspond to the expected location, the system will modify the pattern so that thread printer adjusts the size of one or more segment to automatically account for the misalignment.

System for thread printing using image-based feedback

A system and method for treatment of thread includes a thread printer that applies colored coatings to thread and that passes the treated thread to a fabric weaving system. A camera is positioned to capture images of the treated thread as it is woven into a fabric in the fabric weaving system. The system processes the images to determine whether the location of a selected segment of the treated thread in the fabric corresponds to an expected location in the fabric. If the actual location of the selected segment corresponds to the expected location, the system will continue instructing the thread printer to selectively apply the colored coatings to the thread according to the pattern. However, if the actual location does not correspond to the expected location, the system will modify the pattern so that thread printer adjusts the size of a segments to automatically account for the misalignment.

A printed resistive gas detector configuration that is simple, inexpensive and compact, fabricated for incorporation into an electronic device, such as an electronic computing and/or communication device, the printed resistive gas detector configuration designed to continuously monitor for predetermined types of gasses. The printed resistive gas detector configuration manufactured by the use of printing technology to print on a flexible substrate.

Printed gas sensor

Disclosed is a conformable, stretchable and electrical conductive structure, which includes an auxetic structure, and a plurality of electrical conductors. The plurality of electrical conductors being incorporated within the auxetic structure, to form conformable, stretchable electrical interconnects, configured based on a design of the auxetic structure and placement of the electrical conductors incorporated with the auxetic structure.

Structural designs for stretchable, conformal electrical interconnects

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Los Altos, CA, United States of America

Steven E Ready