Adv Antest Corporation

Electro Scientific Industries, Inc.

Sym-tek Systems, Inc.

Delphon Industries, LLC

Gel Pak L.l.c.

Steven David Swendrowski

Mitsuaki Tani

Carmencita I Robbins

Joseph J Dlugokecki

Gerardo Bagalawig Nazareno

Douglas John Garcia

Vernon P Cooke

Thomas E Toth

Kazuyuki Tsurishima

Jeffrey L Fish

Mark W Klug

Malcolm Vincent Hawkes

Martin J Twite, Iii

Evart David Shealey

Martin S Voshell

Stephen R Lamb

Hsang Wang

A method is provided for reconstructing an integrated circuit package comprising: attaching a die to exposed wire bond pads of a lead frame so that the die is electrically connected to the lead frame; and encapsulating the die and the wire bond pads in an encapsulant; and reshaping an upper surface of the encapsulant where at least a portion of the encapsulant reshaping is performed by a lapping process.

Method for reconstructing an integrated circuit package using lapping

A method is provided for deconstructing an integrated circuit package comprising: taking an integrated circuit package comprising a lead frame having a plurality of wire bond pads for placing a die into electrical contact with the lead frame, and an encapsulant encapsulating the wire bond pads; and removing the encapsulant to expose the wire bond pads; wherein at least a portion of the encapsulant is removed by a lapping process.

Method for deconstructing an integrated circuit package using lapping

One or more concentric rings of component seats are rotatable about the rings' center. The seats are uniformly angularly spaced and the rings are incrementally rotated, the increment of rotation being the angular space between adjacent seats. The rings are inclined at an angle and a stream of components is poured onto the rings as they are rotating. Stationary fences adjacent to outboard sides of the seats, confine unseated components to tumble randomly, due to gravity, over empty seats passing through arcs of the rings' rotation paths. The random tumbling results in seated components. In the paths of the rotating rings are electrical contactors for coupling the components to a tester. Preferably there are five contactor stations to permit five different kinds of tests to be performed simultaneously. Tested components pass beneath an ejection manifold which defines a plurality of ejection holes which register with a set of seats each time the ring is rotated an increment. Ejection tubes are coupled to the ejection holes. The components are ejected from their seats by blasts of air from selectively actuated, respective pneumatic valves. Due to the blast of air and gravity, the ejected components travel down the tubes and are directed into sorting bins according to a tube routing plate. The stream of components can be selectively directed to each fence in response to a signal from a detector indicating that the fence is deprived of components. Sensors detect seated components that were not ejected by the ejection manifold.

Electrical circuit component handler

A separation and transfer apparatus for use in an electronic test system for testing electronic devices such as IC's, and the like. The apparatus has a housing for holding in a horizontal position, a magazine containing such electronic devices, an air blower for blowing compressed air at the electronic devices at an angle through a slit of the magazine so that the electronic devices are separated from one another and urged in a desired direction, a piston pin for insertion into a space developed between the last electronic device in the magazine and one end of the magazine, an advancing apparatus for changing the horizontal position of the air blower and the piston pin and for expelling the electronic devices from the magazine, and a controller for controlling the timing of the air blowing, the movement of the advancing apparatus, and the operation of the piston pin. The invention also includes a transfer apparatus having mounted thereon a second air blower and piston pin for transferring the electronic devices thus expelled from the magazine to the next stage of the test system, such as a temperature chamber. Another aspect of the present invention is a universal electronic device magazine for use in such separation and transfer apparatus, which magazine need not be changed or varied despite differences in the shape and kinds of the electronic devices to be tested.

Separation and transfer apparatus

Growing community of inventors

San Diego, CA, United States of America

Steven David Swendrowski