3m Innovative Properties Company

University of California

Other

3m Innovative Properties

Steven D Theiss

Michael Albert Haase

Paul Frederic Baude

Patrick R Fleming

Tommie W Kelley

Dawn V Muyres

Paul Wickboldt

Patrick M Smith

Paul G Carey

Silva K Theiss

Geoffrey P Morris

William E Wyllie, Ii

Jesse D Wolfe

Babu Nana Gaddam

Martin B Wolk

Moses Mekala David

Hae-Seung Harry Lee

Wayne Scott Mahoney

Robert A Asmus

Pingfan Peter Wu

Rui Yang

Kevin W Gotrik

William A Tolbert

Charles J Studiner, Iv

Jeffrey M Florczak

Bruce E Tait

David H Redinger

Albert R Ellingboe

Ha T Le

Carlos A Barrios

Michael S Graff

Schoen A Schuknecht

Michael W Bench

Eric W Hemmesch

Steven L Johnson

Grace L Ho

Xiaoming Kou

Donovan C C Karg, Jr

Donovan CC Karg

Charles J Iv Studiner

A multilayer magnetic sheet is described which comprises a plurality of stacked magnetic component layers separated by first electrically insulating layers. Each of the plurality of magnetic component layers comprises a plurality of isolated magnetic sublayers having a magnetic layer thickness of less than one micron. The multilayer magnetic sheet has a magnetic fraction between about 5% and about 80%; a total magnetic thickness of greater than or equal to 5 microns; and a relative composite permeability of greater than about 20.

Magnetic multilayer sheet

The present application relates to an apparatus () for supporting sheet material during cutting by laser radiation comprising a support member () having a gold facing layer. A method for cutting sheet material using such apparatus is also defined.

Apparatus and method for laser cutting using a support member having a gold facing layer

Provided are dental articles, and methods of making articles, having an aesthetic inorganic coating based on zirconia at least partially stabilized with yttrium oxide, calcium oxide, cerium oxide, or magnesium oxide. Stabilized zirconia coatings were found to provide a smooth, low friction surface having high abrasion resistance. These coatings are particularly applicable to orthodontic appliances. While virgin stabilized zirconia coatings can often have an undesirable color cast, it was discovered that this color cast can be substantially eliminated by heat treating the coated appliance in an oxygenated environment. The combination of depositing a stabilized zirconia coating and subsequently heat treating to decolorize the coating provides a surprisingly robust, stable, low-friction coating that is also aesthetic.

Coated dental articles and related methods of manufacture

A siloxane-functional isobutylene copolymer and use thereof is described. The copolymer is of the formula: &#x3c;Please insert the chemical formula here as it appears in the paper copy.&#x3e; wherein a is at least 20, and at least one of b and c are at least one, X is oxygen or nitrogen; R1 is a covalent bond or a divalent (hetero)hydrocarbyl group; Sil is a polydialkylsiloxane; and x is 1 or 2. 

Functionalized isobutylene-isoprene copolymer composition

Approaches for formation of a circuit via which electrically connects a first thin film metallization layer a second thin film metallization layer are described. Via formation involves the use of an anodization barrier and/or supplemental pad disposed in a via connection region prior to anodization of the first metallization layer. The material used to form the barrier is substantially impermeable to the anodization solution during anodization, and disrupts the formation of oxide between the electrically conducting layer and the barrier. The supplemental pad is non-anodizable, and is covered by the barrier to substantially prevent current flow through the pad during anodization. Following anodization, the barrier is removed. If the supplemental pad is sufficiently conductive, it can be left on the first metallization layer after removal of the barrier. The second metallization layer is disposed over the anodized layer, making electrical contact with the first electrically conductive layer in the via connection region.

Electrical connections for anodized thin film structures

A plasma hydrogenated region in the dielectric layer of a semiconductor thin film transistor (TFT) structure improves the stability of the TFT. The TFT is a multilayer structure including an electrode, a dielectric layer disposed on the electrode, and a metal oxide semiconductor on the dielectric. Exposure of the dielectric layer to a hydrogen containing plasma prior to deposition of the semiconductor produces a plasma hydrogenated region at the semiconductor-dielectric interface. The plasma hydrogenated region incorporates hydrogen which decreases in concentration from semiconductor/dielectric interface into the bulk of one or both of the dielectric layer and the semiconductor layer.

Stability enhancements in metal oxide semiconductor thin film transistors

Method of fabricating electronic devices is disclosed. The method includes the steps of forming an anodized layer that has a thickness greater than a desired thickness, and forming an electrically conductive layer on the anodized layer. The method further includes the steps of removing the conductive layer in a selected area to expose the anodized layer, and removing the exposed anodized layer until the anodized layer in the exposed area has the desired thickness.

Method of fabricating thin film transistor

Provided is an article that comprises a substrate comprising an acid-etchable layer, a water-soluble polymer matrix, and a photoacid generator. Also provided is a method for patterning that can provide patterned layers that can be used to form electroactive devices.

Patterned photoacid etching and articles therefrom

A method for circuit fabrication includes positioning first and second webs of film in proximity to each other, wherein the second web of film defines a deposition mask, and deposition material on the first web of film through the deposition mask pattern defined by the second web of the to create at least a portion of an integrated circuit.

In-line deposition processes for circuit fabrication

Methods and displays utilize row and column drivers with ZnO channels that control pixel transistors with ZnO channels, which in turn address OLEDs of an array to produce images of a display screen. A display backplane including the ZnO row and column drivers and the OLEDs may be constructed by utilizing aperture masking or a combination of photolithography and aperture masking. Monolithic integration of the ZnO row and column drivers together with the ZnO pixel transistors is thereby achieved.

Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes

Logic circuitry is powered by a partially rectified alternating current (ac) waveform. The waveform is partially rectified in the sense that it does not provide a clean, primarily dc power signal. Instead, it is possible to power logic circuitry with a waveform that includes a substantial ac component. The partially rectified ac waveform may be applied to logic circuitry incorporating thin film transistors based on amorphous or polycrystalline organic semiconductors, inorganic semiconductors or combinations of both.

Logic circuitry powered by partially rectified AC waveform

Aperture masks and deposition techniques for using aperture masks are described. In addition, techniques for creating aperture masks and other techniques for using the aperture masks are described. The various techniques can be particularly useful in creating circuit elements for electronic displays and low-cost integrated circuits such as radio frequency identification (RFID) circuits. In addition, the techniques can be advantageous in the fabrication of integrated circuits incorporating organic semiconductors, which typically are not compatible with wet processes.

Aperture masks for circuit fabrication

Fabrication of silicon thin film transistors (TFT) on low-temperature plastic substrates using a reflective coating so that inexpensive plastic substrates may be used in place of standard glass, quartz, and silicon wafer-based substrates. The TFT can be used in large area low cost electronics, such as flat panel displays and portable electronics such as video cameras, personal digital assistants, and cell phones.

Thin film transistors on plastic substrates with reflective coatings for radiation protection

Logic circuitry powered by partially rectified ac waveform

Growing community of inventors

Woodbury, MN, United States of America

Steven D Theiss