Applied Materials, Inc.

Steven D Marcus

Ning Li

Kevin Griffin

Lei Zhou

Tai T Ngo

Michael Robert Rice

Li-Qun Xia

Mark Joseph Saly

Mihaela A Balseanu

Victor Nguyen

Keiichi Tanaka

Hanish Kumar Panavalappil Kumarankutty

Lisa J Enman

Senthil Kumar Nattamai Subramanian

Kirubanandan Naina Shanmugam

Mei Yin Chang

Jennifer Y Sun

Philip Allan Kraus

Anantha K Subramani

Avgerinos V Gelatos

Dien-Yeh Wu

Xinhai Han

Takashi Kuratomi

Pingyan Lei

Yang Guo

Gayatri Natu

Xiao Ming He

Mahesh Arcot

Ramcharan Sundar

Kesong Hu

Hari Venkatesh Rajendran

Nikshep M Patil

Arun Kumar Kotrappa

Seyyed Abdolreza Fazeli

Sriharsha Dharmapura Sathyanarayanamurthy

Steven Mosbrucker

Shivaprakash Padadayya Hiremath

Sankar Menon Cherubala Pathayapura

Yogesh Tomar

Tianyang Li

Madhukar Krishna

Embodiments of an apparatus for coating a plurality of gas lines are provided herein. In some embodiments, an apparatus for coating a plurality of gas lines via an ALD process includes: an oven having an enclosure that defines an interior volume configured to house the plurality of gas lines, the enclosure having a door configured for transferring the plurality of gas lines into and out of the interior volume; a plurality of inlet ports disposed through a first wall of the enclosure; a plurality of exhaust ports disposed through a second wall of the enclosure; a fluid panel disposed outside of the oven and coupled to the plurality of inlet ports via corresponding ones of a plurality of fluid distribution assemblies; and a foreline disposed outside of the oven and coupled to the plurality of exhaust ports.

Atomic layer deposition coating system for inner walls of gas lines

Provided are self-aligned double patterning methods including feature trimming. The SADP process is performed in a single batch processing chamber in which the substrate is laterally moved between sections of the processing chamber separated by gas curtains so that each section independently has a process condition.

Self-aligned double patterning with spatial atomic layer deposition

Disclosed is a coated chamber component comprising a body having a reduced metal surface such that the reduced metal surface has less metal oxide as compared to an amount of metal oxide on a metal surface that has not been reduced. The metal surface may be reduced by pulsing a reducing alcohol thereon. The reduced metal surface may be coated with a corrosion resistant film that may be deposited onto the reduced metal surface by a dry atomic layer deposition process.

Corrosion resistant film on a chamber component and methods of depositing thereof

Methods and apparatus for coating processing reactor component parts are provided herein. In some embodiments, a part coating reactor includes: a lower body and a lid assembly that together define and enclose an interior volume; one or more heaters disposed in the lid assembly; one or more coolant channels disposed in the lid assembly to flow a heat transfer medium therethrough; a plurality of gas passages disposed through the lid assembly to facilitate providing one or more gases to the interior volume, wherein the plurality of gas passages include a plurality of fluidly independent plenums disposed in the lid assembly; and one or more mounting brackets to facilitate coupling a workpiece to the lid assembly.

Atomic layer deposition part coating chamber

Exemplary substrate processing systems may include a chamber body defining a transfer region. The systems may include a first lid plate seated on the chamber body. The first lid plate may define a plurality of apertures through the first lid plate. The systems may include a plurality of lid stacks equal to a number of the plurality of apertures. The systems may define a plurality of isolators. An isolator may be positioned between each lid stack and a corresponding aperture of the plurality of apertures. The systems may include a plurality of annular spacers. An annular spacer of the plurality of annular spacers may be positioned between each isolator and a corresponding lid stack of the plurality of lids stacks. The systems may include a plurality of manifolds. A manifold may be seated within an interior of each annular spacer of the plurality of annular spacers.

Hot showerhead

Apparatus and methods for spatial atomic layer deposition including at least one first exhaust system and at least one second exhaust system. Each exhaust system including a throttle valve and a pressure gauge to control the pressure in the processing region associated with the individual exhaust system.

Gas separation control in spatial atomic layer deposition

Methods and apparatus for depositing a coating on a semiconductor manufacturing apparatus component are provided herein. In some embodiments, a method of depositing a coating on a semiconductor manufacturing apparatus component includes: sequentially exposing a semiconductor manufacturing apparatus component including nickel or nickel alloy to an aluminum precursor and a reactant to form an aluminum containing layer on a surface of the semiconductor manufacturing apparatus component by a deposition process.

Apparatuses and methods of protecting nickel and nickel containing components with thin films

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San Jose, CA, United States of America

Steven D Marcus