University of California

Lewis & Clark College

Steven D Jones

Ronald S Fearing

Kellar Autumn

Richard E Groff

Carmel Majidi

An integrated circuit chip has one or more electrically conductive nano-fibers formed on one or more contact pads of the integrated circuit chip. The one or more electrically conductive nano-fibers are configured to provide an adhesive force by intermolecular forces and establish an electrical connection with one or more contact pads disposed on the surface of a chip package.

Fabricated adhesive microstructures for making an electrical connection

A fabricated microstructure includes a substrate, a primary fiber, and a plurality of base fibers. The primary fiber has a width less than about 5 microns. Each base fiber of the plurality of base fibers has a first end attached to the primary fiber and a second end attached to the substrate. Each base fiber has a width less than the width of the primary fiber.

Compliant base to increase contact for micro- or nano-fibers

A curved surfaces for adhering to contact surfaces is provided. The structure includes a curved surface with a plurality of nano-fibers disposed thereon. When the curved surface is in a first position, at least one of the plurality of nano-fibers contacts the contact surface and provides an adhesive force at the contact surface. When the curved surface rotates to a second position from the first position, the at least one of the plurality of nano-fibers is leveraged way from the contact surface.

Growing community of inventors

Lafayette, CA, United States of America

Steven D Jones