Applied Materials, Inc.

Steven C Murdoch

Cheng C Wang

Masato M Toshima

Phil M Salzman

Mark A Stenholm

James Howard

Leonard Hall

David K Cheng

Robert J Steger

Mahasukh Vora

A workpiece loading interface is included within a workpiece processing system which processes workpieces, typically wafers, in a vacuum. The workpiece loading interface includes two separate chambers. Each chamber may be separately pumped down. Thus, while a first cassette of wafers, from a first chamber is being accessed, a second cassette of wafers may be loaded in the second chamber and the second chamber pumped down. Each chamber is designed to minimize intrusion to a clean room. Thus a door to each chamber has a mechanism which, when opening the door, first moves the door slightly away from an opening in the chamber and then the door is moved down parallel to the chamber. After the door is opened, a cassette of wafers is lowered through the opening in a motion much like a drawbridge. The cassette may be pivoted within the chamber when the position from which wafers are accessed from the cassette differs from the position from which the cassette is lowered out of the chamber.

Dual cassette load lock

An improved semiconductor wafer transfer method and system incorporates a combination of wafer retractor (14) and wafer lifters (16) built into each processing chamber with a modified transport arm (12) to achieve large enhancements in wafer exchange speeds. The transport arm (12) brings a new wafer into a processing chamber (18) where an already processed wafer waits for retrieval, having been lifted into the central portion of the chamber by lifters (16). In a simultaneous action, lifters (16) lower the processed wafer onto a lower platform of the transport arm (12) while the wafer retractor (14) removes the new wafer from an upper platform of the transport arm (12). Once the transport arm (12) removes the processed wafer from the chamber (18), the retractor (14) lowers the new wafer onto the wafer lifters (16) and processing begins. The transport arm (12) delivers the processed wafer to a wafer buffer (58), which accompanies the transport arm (12), and retrieves a new wafer to start the wafer loading process again with the next processing chamber (18). The method and system of the present invention provides a flexible and rapid solution for loading and unloading wafer processing chambers.

Semiconductor wafer transfer in processing systems

A method and apparatus is disclosed for handling semiconductor wafers used for the production of integrated circuit structures which permits moving the wafer from one processing station to another without direct handling of the wafer and which also permits equal processing of both the top and bottom surfaces of the wafer. A wafer retaining ring is disclosed having structure for engaging the retaining ring to transfer the wafer and the retaining ring from one processing station to another to perform a plurality of processing steps on one or both surfaces of the wafer without direct handling of the wafer. The retaining ring is also provided with structure for engaging the end edges of the wafer leaving both the top and bottom surfaces of the wafer equally exposed for processing. The retaining ring has an inner diameter sufficiently large with respect to the outer diameter of the wafer so as to not interfere with processing by shadowing either side of the wafer.

Method and apparatus for handling semiconductor wafers

A combination gate valve and throttle valve is presented for use between a process chamber and at least one pump includes a base plate a lower plate and a gate plate. The base plate is attached to the process chamber and includes a base plate gas port for each pump in the system. Each pump is attached to the lower plate. Where each pump is attached to the lower plate there is a lower plate gas port. Each of the lower plate gas ports lines up with one of the base plate gas ports. The gate plate is attached between the lower plate and the base plate. The gate plate has gate plate gas ports so that when the gate plate is moved into an open position with respect to the base plate and the lower plate, the gate plate gas ports line up with the lower plate gas ports and the base plate gas ports allowing gas to flow from the process chamber through the gas ports to the pumps. When the gate plate is moved into a closed position the process chamber is selaed from the pumps. The process chamber is now isolated from the pumps allowing the pumps to be removed without contaminating the process chamber.

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Palo Alto, CA, United States of America

Steven C Murdoch