Intermec IP Corporation

Koninklijke Philips Electronics N.v.

Steven C Hugh

Christopher A Wiklof

Pixie Ann Austin

Terry M Hudkins

An antenna structure including a driven antenna element is formed on a substrate that is folded to provide a closed surface, causing the substrate to be nonplanar and spacing the driven antenna element from a base of the substrate. Adhesives on an outside surface of the substrate permit fastening of the folded substrate to a container or packaging. The substrate may have one or more resilient elbows formed by folding, to bias the antenna element carrying portion of the substrate from the base of the substrate. A modulation circuit may drive the driven antenna element. The flexible substrate may be folded into any of a variety of forms such as a substantially O-shape, a substantially oval shape, a substantially coil shape, a substantially spiral shape, and a substantially S-shape. Additional folds in the substrate may provide surfaces for mounting passive or parasitic antenna elements, such as reflectors and directors, to form a Yagi antenna structure. A planar substrate carries a driven antenna element coupled to a driving circuit and at least one passive antenna element to form a directional antenna structure. The antenna structure may include additional passive antenna elements to enhance directionality. A computing system and printer are configured to determine the appropriate spacing and the form the antenna elements on the substrate.

Antenna structure for wireless communications device, such as RFID tag

A memory device comprises a substrate, an antenna on a first surface of the substrate, a microelectronic structure coupled to the antenna, a selectively deformable intermediate layer covering the first surface, the antenna and the microelectronic structure and conforming thereto, and an adhesive layer covering the intermediate layer. The intermediate layer may be deformable for selectively positioning the antenna with respect to the adhesive, and positioning the antenna with respect to an item to which the memory device is secured. The intermediate layer may be compressed, creating a relatively low profile for printing on the memory device. The intermediate layer may be an elastomerically compressible material, such as foam, or may be a selectively pressurizable and deformable envelope. A substantially planar surface of the intermediate layer provides a smooth surface for further manufacturing steps such as forming a protective film layer, a conductive ground layer, or for depositing adhesive and die cutting the RF tag onto a release liner. A face sheet may be positioned on the second surface of the substrate to provide a smooth surface for printing. Alternatively, the intermediate layer may provide a substantially planar surface for the face sheet. The ground layer may be formed from a spent transfer ribbon. A second ground layer and a dielectric layer may form a capacitor.

Wireless memory device

An RF tag for inclusion in a smart label comprises a stiff substrate sized to be received in the smart label, an antenna carried by the substrate and an integrated circuit having a memory circuit carried by the substrate and coupled to the antenna by wire bonding. The substrate may be strain relieved, for example, by forming a pair of generally opposed serpentine edges on the substrate, or forming a plurality of grooves in at least one surface of the substrate. A smart label comprises the RF tag between a face sheet and an adhesive. A release liner may cover the adhesive. A compressably deformable material having a low viscoelastic modulus is received between the first surface of the substrate and the face sheet partially surrounding the circuit structure and wire bonds to hydrostatically protect against damage. A film layer with a blister may envelop the low viscoelastic modulus material.

Growing community of inventors

Bothell, WA, United States of America

Steven C Hugh