Osram Sylvania Inc.

Quarkstar LLC

L3 Cincinnati Electronics Corporation

L3harris Cincinnati Electronics Corporation

Steven C Allen

Andrew Jules Steckl

Yajun Wei

Darrel Endres

Michael J Garter

Robert Jones

David Forrai

Mark Greiner

Joseph Meiners

Ming Chu Li

Richard Speer

Hong Luo

Fred L Palmer

Sarah Bazydola

Camil-Daniel Ghiu

Ming Li

Angela Hohl-AbiChedid

Kerry J Denvir

Kerry Denvir

Fred Palmer

A direct bonding method for infrared focal plane arrays, includes steps of depositing a thin adhesion layer on infrared radiation detecting material, removing a portion of the thin adhesion layer with a chemical-mechanical polishing process, forming a bonding layer at a bonding interface, and bonding the infrared radiation detecting material to a silicon wafer with the thin adhesion layer as a bonding layer. The thin adhesion layer may include SiO, where x ranges between 1.0 and 2.0. The thickness of the thin adhesion layer to form the bonding layer is 500 angstrom or less.

Infrared detector having a directly bonded silicon substrate present on top thereof

Focal plane arrays and infrared detector device having a transparent common ground structure and methods of their fabrication are disclosed. In one embodiment, a front-side illuminated infrared detector device includes a contact layer and a detector structure adjacent to the contact layer. The detector structure is capable of absorbing radiation. The front-side illuminated infrared detector device further includes a common ground structure adjacent the detector structure, wherein the common ground structure is transmissive to radiation having a wavelength in a predetermined spectral band, and the common ground structure has a bandgap that is wider than a bandgap of the detector structure. The front-side illuminated infrared detector device further includes an optical layer adjacent the common ground structure.

Infrared detector devices and focal plane arrays having a transparent common ground structure and methods of fabricating the same

A light emitting device includes a light emitting diode (LED); a transparent optic having a refractive index n; and a phosphor layer spaced apart from the LED and positioned between the LED and the transparent optic. The phosphor layer has an effective refractive index n, where a gap between the LED and the phosphor layer has a refractive index nthat is less than n. The transparent optic has an inner convex surface in contact with the phosphor layer. The inner convex surface has an inner radius of curvature r; and an outer convex surface facing away from the phosphor layer and being a surface through which the light emitting device emits light into a medium adjacent the outer convex surface. The medium has a refractive index n. The outer convex surface has an outer radius of curvature R, such that r/R is equal to n/n.

Nearly index-matched luminescent glass-phosphor composites for photonic applications

Light emitting device including nearly index-matched luminescent glass-phosphor composites

A driver circuit for a light source including one or more solid state light sources, a luminaire including the same, and a method of so driving the solid state light sources are provided. The driver circuit includes a rectifier circuit that receives an alternating current (AC) input voltage and provides a rectified AC voltage. The driver circuit also includes a switching converter circuit coupled to the light source. The switching converter circuit provides a direct current (DC) output to the light source in response to the rectified AC voltage. The driver circuit also includes a mixing circuit, coupled to the light source, to switch current through at least one solid state light source of the light source in response to each of a plurality of consecutive half-waves of the rectified AC voltage.

Driver circuit for solid state light sources

Light emitting device having a specific dimension of phosphor layer

A light emitting device is described. The light emitting device includes a base; a light emitting diode supported by the base; a first layer spaced apart from the light emitting diode and including a light emitting material, the first layer having a refractive index n; a transparent optic having a refractive index nthat is greater than or equal to n, the transparent optic having a convex surface facing away from the light emitting diode and the first layer being positioned between the transparent optic and the light emitting diode. A gap between the light emitting diode and the first layer has a refractive index nthat is less than n, and the convex surface has a radius of curvature sufficiently large relative to a dimension of the first layer to eliminate total internal reflection of light entering the transparent optic from the first layer.

Light emitting device

A light emitting device includes a base; a light emitting diode (LED) supported by the base; a layer spaced apart from the LED and including a light emitting material of refraction index n. An enclosure formed by the layer and the base encloses the LED. A medium inside the enclosure between the LED and the layer has a refraction index n&#x3c;n; and an optic in contact with the layer and having a refraction index n&#x2267;n. The layer is positioned between the optic and the LED. The optic has, at a surface of contact with the layer, a radius r measured along a ray originating from the LED, and, at an output surface of the optic, another radius R measured along the same ray, such that R&#x2267;r&#xb7;(n/n), where nis a refraction index of a medium adjacent the output surface of the optic.

A lamp assembly, and method for making same. The lamp assembly includes first and second truncated reflector cups. The lamp assembly also includes at least one base plate disposed between the first and second truncated reflector cups, and a light engine disposed on a top surface of the at least one base plate. The light engine is configured to emit light to be reflected by one of the first and second truncated reflector cups.

Lamp with a truncated reflector cup

An optical element is disclosed. The optical element includes a single, transparent, rotationally-symmetric lens with a batwing shaped cross-section, extending angularly away from a longitudinal axis. The lens also includes a variety of curved, straight, specular and optionally diffuse portions on its longitudinal and transverse faces, all of which cause a variety of internal and external reflections, refractions, and optionally scattering.

Tir lens for light emitting diodes

A light emitting diode (LED) lamp includes a base with one or more LED chips, an internal cover over the LED chips, where the cover is a translucent ceramic whose thermal conductivity is greater than glass, where the cover has an interior surface separated from the LED chips by a gap, and where an exterior surface of the cover is coated with a phosphor. The ceramic cover preferably has a bulk thermal conductivity of at least 5 W/(m&#xb7;K), such as polycrystalline alumina. The LED chips preferably are blue LEDs and the phosphor is selected so that the lamp emits white light. In the method of making the lamp, the phosphor may be applied to the exterior surface of the cover as a preformed sheet or in a coating.

LED lamp with remote phosphor coating and method of making the lamp

An illuminator is disclosed, in which an LED module emits short-wavelength light toward a phosphor module, which absorbs it and emits wavelength-conditioned light. The emission is generally longitudinal, with a generally Lambertian distribution about the longitudinal direction. The phosphor module includes a transparent layer, closest to the LED module, and a phosphor layer directly adjacent to the transparent layer. Both layers are oriented generally perpendicular to the longitudinal direction. The illuminator includes a reflector, circumferentially surrounding the emission plane in the LED module and extending longitudinally between the emission plane and the transparent layer. Virtually all the light emitted from the LED module either enters the phosphor module directly, or enters after a reflection off the reflector. The transverse side or sides of the transparent layer support total internal reflection, so that virtually all the light that enters the transparent layer, from the LED module, is transmitted to the phosphor layer. In some applications, the phosphor layer is located at the focus of a concave mirror, which can narrow and/or collimate the light emitted by the phosphor. Adjacent to the phosphor layer and opposite the transparent layer, the phosphor module can include a transparent dome, a heat sink, or nothing.

Growing community of inventors

Beverly, MA, United States of America

Steven C Allen