Kic Thermal Profiling

Steven Arthur Schultz

Philip Casimir Kazmierowicz

A method and apparatus for controlling a part temperature profile by optimizing response characteristics based on control parameters acquires part temperature response characteristics at selected conditions to form an index value and calculates linear relationships between the index and its corresponding control parameters. The method searches for the minimum index thereby determining its corresponding optimal control parameters for thermal processing of parts in order that the part temperature profile responds within the target specification range with the greatest margin available. The apparatus determines the minimum index value and its corresponding the optimum control parameters.

Method and apparatus for optimizing control of a part temperature in conveyorized thermal processor

A method for maximizing throughput for thermal processing of a part searches for the maximum conveyor speed while calculating a Process Window Index that is less than a required value. The best Process Window Index associated with the maximum conveyor speed corresponds to a maximum throughput control series with which to set the control parameters of the thermal processor.

Method for maximizing throughput of a part in a conveyorized thermal processor

A method for aligning a boundary condition temperature in a thermal processor utilizes an air temperature measurement. During the thermal process, air temperature measured along an interval series forms an air profile and provides a reference to which the boundary condition temperature may be aligned. A method for aligning a part temperature profile to the processor temperature profile uses the measured air temperature to adjust the part temperature profile, so as to be synchronized with the air temperature profile. These procedures may be used in conjunction with setpoint parameter prediction for attaining a target part temperature response.

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Gardena, CA, United States of America

Steven Arthur Schultz