Xerox Corporation

Palo Alto Research Center Inc.

Steven A Buhler

Karl Anthony Littau

John Stuart Fitch

Baomin Xu

Scott Alan Elrod

Scott Eugene Solberg

Michael C Weisberg

William S Wong

Meng H Lean

Tuan Anh Vo

Stephen David White

Mohamad M Mojaradi

Babur B Hadimioglu

Scott Jong Ho Limb

Jaime Lerma

Ellis D Harris

Mehrdad Zomorrodi

Lamar T Baker

Abdul M Elhatem

Peter Johan Nystrom

Eric J Shrader

Richard G Stearns

Cathie J Burke

Joy Roy

Igor Abramov

Mostafa R Yazdy

Richard Schmachtenberg, Iii

Parviz P Mazdiyasni

David Kalman Biegelsen

David Allen Mantell

Vittorio R Castelli

Jeffrey J Folkins

David Kirtland Fork

John Richard Andrews

Jurgen Hans Daniel

Richard N Ellson

James William Stasiak

Guillermo Lao

Russel A Martin

Alan J Werner, Jr

Harold M Anderson

Abdul M ElHatem

William F Gunning

Sharon S Berger

Patrick C P Cheung

Mohammad M Mojarradi

Michael Y Young

Iftikhar Ahmed

Michael Yu Tak Young

James Charles Zesch

Beverly Russo

Shi-Tron Lin

Thomas Long

John R Bachellerie

Abdul M El Hatem

Michael C Welsberg

Timothy Trang

Abdul M El Haten

Putul D Patel

Hamid T Bahramian

A fabricated structure for use with an associated marking device is provided. In one form, the fabricated structure includes a self-lifting spring finger having a nib for marking.

Self-assembling structures for electrostatic extraction of pigments from liquid inks for marking

A method of forming a fluid ejector includes forming a recess well into a silicon wafer on a first side of the silicon wafer, and filling the recess well with a sacrificial material. A thin layer structure is deposited onto the first side of a silicon wafer covering the filled recess well. Then a thin film piezoelectric is bonded or deposited to the thin layer structure, and a hole is formed in the thin layer structure exposing at least a portion of the sacrificial material. The sacrificial material is removed from the recess well, wherein the hole in the thin layer in the recess well with the sacrificial material removed, form a fluid inlet. An opening area in the silicon wafer is formed on a second side of the silicon wafer. Then a nozzle plate is formed having a recess portion and an aperture within the recess portion. The nozzle plate is attached to the second side of the silicon wafer, with the recess portion positioned within the open area. The thin layer structure and the recess portion of the nozzle plate define a depth of a fluid cavity defined by the thin layer structure, the recess portion of the nozzle plate and the sidewalls of the silicon wafer.

Method of forming micromachined fluid ejectors using piezoelectric actuation

A side-firing printhead comprises a stack that includes a plurality of slices, wherein each slice includes a PCB trigger layer and a diaphragm layer, the PCB trigger layer controls the flow of ink from the diaphragm layer, a first side of the diaphragm layer includes at least one cavity that delivers ink via one or more aperture braces. An aperture plate is coupled to one side of the stack to interface to the diaphragm layers contained therein, wherein the aperture plate contains a plurality of apertures that are located at each aperture brace. A first bracket is disposed on the top of the stack and a second bracket is disposed on the bottom of the stack, wherein at least one fastener couples the second bracket to the first bracket such that a predetermined amount of pressure is applied to the stack.

Stacked slice printhead

A method is provided that includes providing a mold on a temporary substrate, e.g., a sapphire substrate. Next, a material such as PZT paste is deposited into the mold. Then, the mold is removed to obtain elements formed by the mold. The formed elements will then be sintered. After sintering, electrode deposition is optionally performed. The sintered elements are then bonded to a final target substrate and released from the temporary substrate through laser liftoff. Further, electrodes may also be optionally deposited at this point.

Method for forming ceramic thick film element arrays with fine feature size, high-precision definition, and/or high aspect ratios

A fluid ejector including a silicon wafer having a first side and a second side. A multi-layer monolithic structure is formed on the first side of the silicon wafer. The multi-layer monolithic structure includes a first structure layer formed on the first side of the silicon wafer, and the first structure layer has an aperture. A second structure layer has a horizontal portion and closed, filled trenches or vertical sidewalls. The first structure layer, horizontal portion and the closed, filled trenches or vertical sidewalls of the second structure layer define a fluid cavity. An actuator is associated with the horizontal portion of the second structure layer, and an etched portion of the silicon wafer defines an open area which exposes the aperture in the first structure layer.

Multi-layer monolithic fluid ejectors using piezoelectric actuation

A method of producing at least one piezoelectric element includes depositing a piezoelectric ceramic material onto a surface of a first substrate to form at least one piezoelectric element structure. Then an electrode is deposited on a surface of the at least one piezoelectric element structure. Next, the at least one piezoelectric element structure is bonded to a second substrate, the second substrate being conductive or having a conductive layer. The first substrate is then removed from the at least one piezoelectric element structure and a second side electrode is deposited on a second surface of the at least one piezoelectric element structure. A poling operation is performed to provide the at least one piezoelectric element structure with piezoelectric characteristics.

Methods to make piezoelectric ceramic thick film array and single elements with a reusable single layer substrate structure

Various fluidic techniques can employ ducting structures, such as microstructures, that extend between other components, such as plate-like structures. A ducting structure can, for example, include an inlet opening toward or near one plate-like structure, an outlet opening toward or near another plate-like structure, and a duct in which fluid flows after being received through the inlet opening and before being provided through the outlet opening. In some implementations, a ducting structure is photo-defined, such as by exposing a photoimageable structure and then removing either exposed or unexposed regions. In some implementations, a ducting structure is a freestanding polymer microstructure. In some implementations, ducting structures are microstructures that extend approximately the same length between first and second plate-like structures, and have a ratio of length to maximum cavity diameter of approximately two or more. A printhead implementation includes an array of such microstructures supported between drive side and drop side assemblies.

Fluidic structures

A micromachined fluid ejector includes an ejector body having a fluid cavity for holding fluid to be ejected and a piezoelectric actuator for ejecting the fluid. A nozzle plate is placed in operable association with the ejector body. The configuration of the nozzle plate is selected to adjust a volume of the fluid cavity to obtain a desired mechanical impedance matching between the fluid and the actuator.

Micromachined fluid ejectors using piezoelectric actuation

A liquid drop ejector comprising a jet stack, thin film or thick film heaters formed on the surface of the jet stack, and at least one thin film or thick film temperature sensor operative to provide feedback temperature control for the thin film or thick film heater elements is provided. In one form, the liquid drop ejector also has the thin film or thick film heater elements grouped in segments that are operative to be individually controlled. In addition, in another form, the signal lines provided to the liquid drop ejector are patterned to allow for more uniform resistance over the span of the liquid drop ejector.

Thin film and thick film heater and control architecture for a liquid drop ejector

A selectively configurable beam and systems utilizing such are disclosed. The distribution of mass of the beam can be selectively adjusted or altered by adjusting one or more characteristics of the beam. Specific strategies utilizing continuous electro-wetting, and selective formation or movement of gases in liquid are disclosed. The selectively configurable beams are used in systems for harvesting vibrational energy from vibrating bodies.

Energy scavengers which adjust their frequency by altering liquid distributions on a beam

A circuit provides energy to a plurality of piezoelectric diaphragm structures formed in a two-dimensional array. Each piezoelectric diaphragm structure includes a piezoelectric element in operational contact with at least a first side electrode and a second side electrode. A switching system includes a first connection for a first power source, for application of power to the first side electrode and a second connection for a second power source, for application of power to the second side electrode. In a first state, power appropriate for performing a poling operation of the piezoelectric material is available for application to the first electrode, and the second electrode, and in a second state, power appropriate to activate the piezoelectric material to cause operational movement of the poled piezoelectric diaphragm structure is available for application to the first electrode and the second electrode.

Method of fabricating an array of multi-electroded piezoelectric transducers for piezoelectric diaphragm structures

A method of producing at least one thick film element, including depositing a material on a surface of at least one first substrate to form at least one thick film element structure having a thickness of approximately greater than 10 &#x3bc;m to 100 &#x3bc;m. Then, then the at least one thick film element structure is bonded to a second substrate, and the at least one first substrate is removed from the at least one thick film element structure using a lift-off process employing radiation energy. The lift-off process including emitting, from a radiation source, a radiation beam through the first substrate to an attachment interface formed between the first substrate and the at least one thick film element structure at the first surface of the first substrate. The first substrate being substantially transparent at the wavelength of the radiation beam, permitting the radiation beam to generate sufficient energy at the interface to break the attachment.

Methods for making thick film elements

An electronic circuit is utilized to correct scan non-linearity of a raster output scanner. The circuit modulates a clock frequency to match a scan linearity error profile. Because it is a separate circuit, the exiting closed-loop clock generator does not need to be modified. The correction circuit synchronizes itself with the clock signal using a counter/subtractor phase detector, which ensures that the phase and frequency of the internal clock matches the phase and frequency of the master.

Scan non-linearity correction using frequency modulation and synchronization with a master clock

Poling system for piezoelectric diaphragm structures

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Sunnyvale, CA, United States of America

Steven A Buhler