Cirrus Logic Inc.

Nxp Usa, Inc.

Freescale Semiconductor,inc.

Steven A Atherton

John Blake Pavelka

Jonathan Taylor

Yaoyu Pang

John Kerr

James Munger

Craig McAdam

Douglas Macfarlane

Brian David Young

Stanley A Cejka

William J Downey

James C Golab

A semiconductor die may be coupled to a printed circuit board using a solder ball. The semiconductor die comprises a redistribution layer formed above a semiconductor chip, a polymer layer formed on the redistribution layer, and an Under Bump Metallurgy (UBM) layer formed on the polymer layer. The polymer layer comprises a plurality of vias, which electrically couple the UBM layer to the redistribution layer. The entire UBM layer may be deposited with a continuously flat upper surface for coupling to the solder ball. The plurality of vias may be positioned such that they are centered on a point that is not central to the UBM layer.

Via structure for semiconductor dies

The present disclosure relates to a chip scale package (CSP) comprising: a first set of CSP contact balls or bumps; a second set of CSP contact balls or bumps; and a channel routing region, the channel routing region being devoid of any CSP contact balls or bumps.

Chip scale package

A method for forming a semiconductor device package substrate including a fiducial mark is provided. The method of forming the package substrate includes forming a dielectric layer over a lower portion of the package substrate. A metal layer is formed over a fiducial region of the package substrate. The metal layer is etched to form a first signal line in the fiducial region. A passivation layer is formed over the first signal line. The passivation layer is etched over the first signal line to form a fiducial mark.

Semiconductor device package substrate having a fiducial mark

A circuit device mounted on a substrate includes a detection circuit that monitors a characteristic of a return signal to determine an integrity of various interconnects of the device.

Integrated circuit interconnect crack monitor circuit

Growing community of inventors

Austin, TX, United States of America

Steven A Atherton