Qimonda Ag

Steve Wood

Richard Johannes Luyken

Georg Braun

Anthony Sanders

Dirk Scheideler

Edoardo Prete

Hans-Peter Trost

Hermann Ruckerbauer

Roland Irsigler

Anton Legen

Carsten Niepelt

An apparatus for providing a signal for transmission via a signal line includes a controller circuit having an output for a signal indicating whether the signal line is or will be in an inactive state and a switching circuit coupled to the controller circuit and having an output coupled to the signal line. The output is switched between different signal levels, if the signal indicates that the signal line is in an inactive state.

Apparatus and method for providing a signal for transmission via a signal line

A device can be used for applying a cooling element onto a module. The cooling element has a first side part and a second side part opposite the first side part. The first and second side parts are connected by a region. The device includes a spreader, which is adapted to spread apart the first and second side parts by mechanical pressure action on mutually opposite sides of the first and second side parts, so as to be able to guide a predetermined region of the module between the first and second side parts.

Assembly device and assembly method for a cooling element

An apparatus being connectable as a latch stage into a asynchronous latch chain comprises a reception interface, wherein upon receipt of the first signal at the reception interface, the apparatus switches to one of the first power saving mode and a second power saving mode, depending on the second signal at the reception interface and wherein the apparatus offers a first power consumption and a first wake-up time in the first power saving mode, and a second power consumption and a second wake-up time in the second power saving mode.

Apparatus and method for switching an apparatus to a power saving mode

A semiconductor device having a stacked arrangement of a substrate and a first chip and a second chip is disclosed. In one embodiment, the first chip is arranged with a lower face on an upper face of the substrate; the second chip with a lower face on an upper face of the first chip, whereby a partial area of the upper face of the first chip that is adjacent to an edge of the first chip is uncovered by the second chip; a fifth wire contact pad is arranged on the uncovered area of the upper face of the first chip; a first bonding wire is arranged that is connected with a first wire contact pad of the substrate and the fifth wire contact pad of the first chip.

Semiconductor device

An apparatus interfaces a first circuit using a first supply voltage and a second circuit using a second supply voltage different from the first supply voltage. The apparatus includes a driver circuit having a driver network comprising driver supply voltage terminals connected to controllable switches. The controllable switches include resistive elements or are separated from resistive elements. A receiver circuit has a receiving network comprising a resistive element and receiver supply voltage terminals and a connection line connecting the driver circuit and the receiving circuit. The controllable switches have two switch configurations, a first switch configuration resulting in a high voltage on the connection line and a second switch configuration resulting in a low voltage on the connection line.

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Munich, Germany

Steve Wood