Hewlett-packard Development Company, L.p.

Steve Ringwald

Kevin E Swier

Douglas Pederson

David Soriano

Kevin B Hulick

Samrin Sing

Gunay Ozturk

Nicola Baldo

Matthew Baker

In example implementations, a powder level sensor is provided. The powder level sensor includes a capacitive sensor, a processor, and a cleaning mechanism. The processor is communicatively coupled to the capacitive sensor. The processor interprets a measurement of the capacitive sensor to detect a layer of residual build material on a surface of the powder level sensor. The cleaning mechanism may be communicatively coupled to the processor. The processor activates the cleaning mechanism to remove the layer of residual build material on the surface of the powder level sensor.

Cleaning mechanisms for build material level sensors

In an example implementation, a powder metering device to move powder in a 3D printing system includes a rotor comprising a central hub and peripheral wheel to rotate about a shaft. Compartments are formed between the hub and the wheel by a plurality of fins that emanate from the hub at first fin ends and affix to the wheel at second fin ends. A top and bottom disk each have a planar surface to lie flush against and to seal, respectively, top and bottom perimeters of each compartment as the compartments rotate about the shaft between a powder receiving position and a powder dispensing position.

Moving powder in a 3D printing system

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Corvalis, OR, United States of America

Steve Ringwald