Intel Corporation

Steve P Frayne, Jr

Barnes Cooper

Ioan Sauciuc

Eric DiStefano

Javier Leija

Sridhar V Machiroutu

Jim Hermerding

A heatsink comprises a base (), a fin () attached to the base, and a piezoelectric patch () attached to the fin. The piezoelectric patch causes the fin to oscillate, thus generating air circulation near the fin surface. This airflow disturbs the boundary layer near the fin and dramatically increases the heat transfer from the fin to air compared to a non-oscillating fin, even for the same bulk flow rate.

Heatsink, method of manufacturing same, and microelectronic package containing same

A method of creating a thermal influence table to describe thermal relationships between components in a system and use of the thermal influence table in a system is described. The thermal influence matrix may be generated dynamically for a system. The matrix may be used by a thermal management policy to enable a hot device to be cooled by power management of another device in the system.

Determining the thermal influence of components within a system and usage of a matrix for power and thermal management

Growing community of inventors

Mountain View, CA, United States of America

Steve P Frayne, Jr