Keyssa, Inc.

Keyssa Licensing, Inc.

Steve Novak

Ian A Kyles

Roger Dwain Isaac

Gary Davis McCormack

John Wolcott

Kenneth R Kveton

Michael A Bourdess

Sridhar Subramanian

Srikanth Gondi

Sunderraj V Palaniraj

Stephen Robert Venuti

Ken Kveton

Mike Bourdess

Gary D Mccormack

Embodiments discussed herein refer to systems, methods, and circuits for establishing EHF contactless communications links. The EHF contactless communication link may serve as an alternative to conventional board-to-board and device-to-device connectors. The link may be a low-latency protocol-transparent communication link capable of supporting a range of data rates. The link may be established through a close proximity coupling between devices, each including at least one EHF communication unit. Each EHF unit involved in establishing an EHF communication link may progress through a series of steps before data can be transferred between the devices. These steps may be controlled by one or more state machines that are being implemented in each EHF communication unit.

Extremely high frequency systems and methods of operating the same

EHF communication systems described herein can selectively implement any one of the USB standards by mapping appropriate USB signal conditions over an EHF contactless communication link. The EHF contactless communication link may serve as an alternative to conventional board-to-board and device-to-device connectors, and as such enables wired connection USB signaling protocols to be used in a non-wired environment provided by the EHF contactless communications link. Use of a USB protocol over the EHF communications link can be accomplished by establishing the EHF link between counterpart EHF communication units, and then by establishing the appropriate USB protocol over the link.

Extremely high frequency systems and methods of operating the same to establish USB data transport protocols

Systems, and apparatus for aligning structures are provided. One of the apparatus includes a first communication module including: a printed circuit board, one or more integrated circuit packages mounted on the printed circuit board, and one or more magnets positioned relative to the one or more integrated circuit packages, wherein the one or more magnets are configured to attractively couple the first communication module to a second communication module positioned in proximity to the first communication module.

Communication module alignment

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South Lake Tahoe, CA, United States of America

Steve Novak