Intel Corporation

Steve J Lofland

Lloyd L Pollard, Ii

Daryl James Nelson

Scott L Noble

James S Webb

Michael T Zhang

Mark A Trautman

Murli Tirumala

Don Weiss

Eric J Salskov

Jim Webb

A novel cold plate may include one or more of the following features: relatively narrow channel gaps, two or more flow paths, primarily non-linear flow paths, and/or tapered channel walls.

Cold plate

A method and apparatus for cooling components within a computer system chassis. In one embodiment, a cooling duct unit includes an air moving unit base with an air moving unit to draw and accelerate air from outside a computer system chassis to a high velocity airflow. Connected to the air moving unit base is a duct to converge and change the high velocity airflow from a circular shape to a noncircular shape. The converged and changed high velocity airflow is directed to cool a device within a computer system chassis. As a result, the device within the computer system is chassis cooled more uniformly and efficiently, while reducing acoustic noise and providing a modular cooling duct unit design for ease of attachment and removal.

Converging cooling duct for a computer cooling system

An integrated heat sink that can provide heat dissipation from multiple components mounted on a circuit board with each component having a different height dimension relative to each other is described. The heat sink has a first face on which a plurality of cooling fins are formed and a second face on which at least one pedestal is formed. The pedestal has a contacting surface to thermally couple to at least one of the multiple components to dissipate heat therefrom. The heat sink is designed to prevent a junction temperature at the contact area where the heat sink and each of the components abut one another from exceeding a maximum design value for the system. In one embodiment of the present invention, the heat sink has a groove formed in the second face. A conductive gasket is disposed in the groove and contacts a metal trace on the circuit board when the heat sink is attached to the circuit board to form a Faraday cage or EMI shield.

Integrated heat sink for different size components with EMI suppression features

An apparatus and method for minimizing electromagnetic interference in a microcomputing system. The apparatus and method of the present invention are based on the fundamental aspect of providing an EMI shield specifically dimensioned to receive a microprocessor within the microcomputing system. The apparatus and method of the present invention are further based on the aspect of providing at least one ferrite bead along a power delivery path to attenuate any high-frequency leakage current from the microprocessor that results at the resonant frequencies of the EMI shield.

Apparatus and method for minimizing electromagnetic interference in microcomputing systems

A modular cooling apparatus for computer systems is disclosed. The apparatus includes an air-guiding duct, a fan coupling to the duct and a coupling apparatus for coupling the air-guiding duct and the fan to an electronics housing. The air-guiding duct has an input opening to the exterior of the electronics housing and guides ambient outside air to the input of the fan. Then the fan directs this outside air to the inside of the electronics housing. The electronic housing can be formed between a base module and the computer system circuit board or between the air-guiding duct, fan and a retention module. Furthermore, outside air is delivered in a substantially perpendicular direction relative to the plane of the computer system circuit board within the electronics housing.

Fan duct module

An apparatus for dissipating heat generated by electronic components on a surface of a memory module and a method of assembling the apparatus are provided. The apparatus includes substantially identical first and second heat exchanger members, each having a heat spreader member thermally coupled to a heat sink member. The two heat exchanger members are positioned on opposing sides of a memory module and assembled together about the module. A surface of the heat spreader member is configured to engage electronic components on the surface of the memory module. A clip member protruding from an edge of each heat exchanger member is also provided. The first heat exchanger clip member is configured to engage an edge of the second heat exchanger member and the second heat exchanger clip is configured to engage an edge of the first heat exchanger member to releasably lock the first and second heat exchanger members together about the memory module.

Clip on heat exchanger for a memory module and assembly method

An apparatus for retaining a circuit board in a connected position is constituted with at least a first retention arm and a first clip that cooperate with each other and with a first edge of the circuit board to securely retain the first edge. The first retention arm includes a first end that is geometrically shaped to allow the first clip to slide onto the first end and slide towards the first edge. The first edge and the first clip further include first complementary engagement features for the first clip to engage the first edge when the first slip slide up against the first edge. Furthermore, the first end includes a deflectable stop lever that can be depressed to allow the first clip to slide over it, and then be released to snugly engage a first notch of the first clip to keep the first clip from sliding back off the first end.

Growing community of inventors

Portland, OR, United States of America

Steve J Lofland