Rockwell Collins, Inc.

Steve I Lebo

Scott J Sellner

Timothy E Snodgrass

Robert R Jakoubek

Richard D Spring

A ruggedized electronics sub-system module is disclosed. The ruggedized electronics sub-system module includes a ruggedized housing and an electronic sub-system environmentally sealed within the ruggedized housing. At least one electrical interface is configured to couple to an external electrical connector.

Ruggedized electronics sub-system module

A modular radio includes a chassis holding a network infosec unit module; a power amplifier module; and at least one transceiver module. Each of the modules include a separate housing and is removable and replaceable. The modules communicate via a bus and are reconfigurable along the bus. The transceivers support a channel that may be reprogrammable by the network interface.

Modular communication platform

A ruggedized electronics sub-system module is disclosed. The ruggedized electronics sub-system module includes a ruggedized housing and an electronic device supported by the housing. The ruggedized electronics sub-system module also includes an electrical connector coupled to the electronic device and supported by the housing. The ruggedized electronics sub-system module further includes a plurality of ruggedized cooling pins extending from the housing. The plurality of pins are spaced so as to allow for natural convective currents or forced air to be used for cooling the electronic device.

Ruggedized electronic module cooling system

A ruggedized electronics module is disclosed. The ruggedized electronics module includes a housing supporting an electronic subsystem device. The housing is environmentally sealed. The ruggedized electronics module also includes a module restraint extending from the housing the restraint is configured to mate with a complementary shaped restraint on a mounting adapter. The module restraint is configured to restrain the module from movement in six degrees of freedom.

Electronic module restraint apparatus

A chassis for a ruggedized modular electronics system is disclosed. The chassis includes an open support structure that is configured to support ruggedized electronics modules. The open support structure allows ambient airflow around the exterior of the ruggedized electronics modules. A first electrical connector is supported by the support structure and a second electrical connector is supported by the support structure. The second electrical connector is electrically coupled to the first electrical connector.

Modular electronics system chassis

A ruggedized electronics system is disclosed. The ruggedized electronics system includes at least one ruggedized electronics module. The electronics module has an electrical module coupling. The ruggedized electronics system also includes an open framed chassis provided with more than one electrical chassis coupling. At least one electrical chassis coupling is coupled to at least one electronic module. The electronics modules may be coupled to and decoupled from the chassis, so that the system may be selectively reconfigured.

Modular electronics system package

A ruggedized electronics module is disclosed. The ruggedized electronics module includes a housing supporting an electronics sub-system device. A module restraint extends from the housing. The module restraint is configured to mate with a complementary shaped restraint on a mounting adapter. The module restraint is configured to restrain the module from movement in six degrees of freedom. The module restraint includes a first surface extending from and sloping away from the housing. The module restraint also includes a second surface extending from and sloping away from the housing. The first surface intersects the second surface and the first and second surfaces slope away from each other.

Growing community of inventors

Cedar Rapids, IA, United States of America

Steve I Lebo