Maxim Integrated Products, Inc.

Steve Detlev Cate

Ajay Kumar Ghai

Christo Pavel Bojkov

Pradip Dhirajlal Patel

Duane Wilcoxen

Proximity sensor devices are described that integrate a light emitting diode with a light sensor assembly in a single, compact package. The proximity sensor devices comprise a lead frame having a surface. The light emitting diode and light sensor assembly are mounted to the lead frame proximate to the surface. The light emitting diode is configured to emit electromagnetic radiation in a limited spectrum of wavelengths, while the light sensor assembly is configured to detect electromagnetic radiation in the limited spectrum of wavelengths emitted by the light emitting diode. An encapsulation layer is formed on the surface over the light emitting diode and light sensor assembly. A trench is formed in the encapsulation layer to receive electromagnetic radiation blocking material configured to block electromagnetic radiation in the limited spectrum of wavelengths to at least partially mitigate crosstalk between the light emitting diode and the light sensor assembly.

Proximity sensor device

An integrated circuit including solder balls containing an elastic or resilient material core, a hard or rigid shell substantially enclosing the core, and an electrical contact layer substantially enclosing the shell. The elastic or resilient core serves as a stress buffer layer in a wafer level package (WLP) integrated circuit. The elastic or resilient material core may include an organic plastic material, such as a Divinilbenzene cross-linked co-polymer of relatively high resistance. This material has a relatively good elongation property so that it can effectively absorb forces exerted upon the integrated circuit by, for example, the flexing of a printed circuit board (PCB) or other structure to which the integrated circuit is attached. The hard or rigid shell serves to contain the elastic or resilient core and may include copper. The electrical contact layer serve to provide a good adhesive electrical contact to an under bump metallization (UBM) layer, may include a lead free, Tin-Gold (SnAg) material.

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Los Altos, CA, United States of America

Steve Detlev Cate