At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Steve Anderson

Martin Schrems

Markus Leitgeb

Marco Gavagnin

Erich Schlaffer

Roland Winkler

An electronic device including a first component carrier, a second component carrier connected with the first component carrier so that a thermal decoupling gap is formed between the first component carrier and the second component carrier, a first component on and/or in the second component carrier, and a second component having a first main surface mounted in the thermal decoupling gap so that at least part of an opposing second main surface and an entire sidewall of the second component is exposed with respect to material of the first component carrier and with respect to material of the second component carrier.

Electronic module with single or multiple components partially surrounded by a thermal decoupling gap

A component carrier including i) an electronic component embedded in the component carrier, ii) an antenna structure arranged at a region of a first main surface of the component carrier, iii) a shielding structure made of an electrically conductive material and configured for shielding electromagnetic radiation from propagating between the antenna structure and the electronic component. Hereby, the shielding structure is arranged at least partially between the antenna structure and the electronic component. Furthermore, the component carrier includes an electrically conductive structure to electrically connect the electronic component and the antenna structure through the shielding structure. The shielding structure is non-perforated at least in a plane between the antenna structure and the electronic component.

RF functionality and electromagnetic radiation shielding in a component carrier

A method of manufacturing a component carrier includes providing a known-good layer stack comprising an already formed electrically conductive connection structure and a known-good cavity, and mounting a known-good component on the already formed electrically conductive connection structure in the cavity.

Growing community of inventors

Gilbert, AZ, United States of America

Steve Anderson