Semiconductor Components Industries, LLC

Stevan Gaurdello Hunter

Gordon M Grivna

Michael Thomason

Bryce A Rasmussen

Troy L Ruud

An electronic device can include one or more trenches that include a material that defines one or more voids. In an embodiment, the substrate defines a first trench having a first portion and a second portion laterally adjacent to the first portion, wherein the first portion has with a first width, the second portion has a second width, and the first width is wider than the second width. The material defines a first void at a predetermined location within the first portion of the first trench and has a seam within the second portion of the first trench. In another embodiment, the substrate defining a trench, and the material that defines spaced-apart voids at predetermined locations within the trench. A process of forming the electronic device can include patterning a substrate to define a trench, and depositing a material within the trench, wherein the deposited material defines a void.

Process of forming an electronic device including a material defining a void

A design rule checker that performs a maximum pattern density check in a first intermediary metallization layer that underlies a top metallization layer and a pad opening in an integrated circuit. The maximum pattern density check is performed at least under some circumstances if a modulus of the primary metallization material is less than a modulus of a surrounding dielectric material. The maximum pattern density check verifies that the pattern density within the underlying portion is below a maximum pattern density that depends on the thickness of the access pad. A maximum metal width check may also be performed in this portion.

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Pocatello, ID, United States of America

Stevan Gaurdello Hunter