Sri International

University of Colorado

Sarnoff Corporation

Sterling Eduardo McBride

Joey John Michalchuk

Dana Zachary Anderson

Steven A Lipp

Matthew Squires

Evan Salim

Winston Kong Chan

Christopher E Holland

Seth Charles Caliga

Ashish Chaudhary

Jesse Wodin

William Frederick Holmgren

Cale M Gentry

Kaitlin Moore

Joey J Michalchuk

The disclosure describes vacuum cell assemblies that integrate a vacuum envelope with a photonic integrated circuit (PIC). Walls of the vacuum envelope are coupled to the PIC, such as through anodic bonding, so that the PIC forms at least one wall of the vacuum envelope and provides an optically accessible medium and surface for transmitting and distributing light into various cavities of the vacuum envelope through one or more nonplanar waveguides. A surface of the PIC may include a material that is compatible with a material of the walls of the vacuum envelope, such as a silicon-based vacuum envelope bonded to a silicon nitride or amorphous silicon surface of the PIC. Each waveguide may include a bridge structure that forms a planar surface for tightly bonding with the vacuum envelope and preserves properties of the transmitted light between opposing sections of the waveguide.

Integrated vacuum cell assemblies

A sensor comprising a vapor cell including a vapor of alkali atoms is disclosed. The sensor further comprises a first photonic integrated circuit (PIC) configured to direct light of a first wavelength into the vapor cell and incident on the vapor of alkali atoms, wherein the light of the first wavelength is configured to excite the alkali atoms to a first excited state from a ground state. The sensor further comprises a detector configured to detect a response of the alkali atoms, after the alkali atoms are excited from the first excited state to a Rydberg state, to incident electromagnetic radiation.

Quantum electromagnetic field sensor and imager

The disclosure includes an outer electrode and an inner electrode. The outer electrode defines an inner volume and is configured to receive injected electrons through at least one aperture. The inner electrode positioned in the inner volume. The outer electrode and inner electrode are configured to confine the received electrons in orbits around the inner electrode in response to an electric potential between the outer electrode and the inner electrode. The apparatus does not include a component configured to generate an electron-confining magnetic field.

Compact electrostatic ion pump

A cold-atom system has multiple vacuum chambers. One vacuum chamber includes an atom source. A fluidic connection is provided between that vacuum chamber and another vacuum chamber. The fluidic connection includes a microchannel formed as a groove in a substantially flat surface and covered by a layer of material.

Channel cell system

Cold-atom systems and methods of handling cold atoms are disclosed. A cold-atom system has multiple chambers and a fluidic connection between two of the chambers. One of these two chambers includes an atom source and the other includes an atom chip.

Ultracold-matter systems

The present invention provides an improved cold-atom system having multiple chambers such that a first of the chambers includes an atom source. The system also includes an atom trap disposed inside a second of the chambers. A fluidic connection is provided between the first of the vacuum chamber and the second of the vacuum chamber.

The present invention provides an improved alkali metal dispenser which is pure and free of contaminant gases, and provides for controlled releasing, delivery and recycling of the alkali metal in multiple stages in a controlled manner. The present invention also provides an alkali metal pump or getter.

Alkali metal dispenser and uses for same

The present invention discloses an anodically bonded vacuum cell structure with a glass substrate including a cavity, and a substrate deposited on the glass substrate, thereby enclosing the cavity to form a bonding interface. The bonding interface having silicon such that the substrate includes a layer of silicon or a secondary substrate with silicon layer bonded onto the secondary substrate.

Growing community of inventors

Princeton, NJ, United States of America

Sterling Eduardo McBride