Cray Incorporated

Mobile Semiconductor Corporation

Cirrascale Corporation

Vs Acquisition Co. LLC

Stephen V R Hellriegel

Alexander I Yatskov

Brian D Koblenz

Mario L Jaena

David Driggers

Louis Cameron Fisher

Mohammad S Ahmadnia

Hampton Walker Haddock, Jr

David Louis Anderson

Douglas Patrick Kelley

Richard K Kunze

An adaptive memory system is provided for improving the performance of an external computing device. The adaptive memory system includes a single controller, a first memory type (e.g., Static Random Access Memory or SRAM), a second memory type (e.g., Dynamic Random Access Memory or DRAM), a third memory type (e.g., Flash), an internal bus system, and an external bus interface. The single controller is configured to: (i) communicate with all three memory types using the internal bus system; (ii) communicate with the external computing device using the external bus interface; and (iii) allocate cache-data storage assignment to a storage space within the first memory type, and after the storage space within the first memory type is determined to be full, allocate cache-data storage assignment to a storage space within the second memory type.

Adaptive memory system for enhancing the performance of an external computing device

A data center inside a shipping container having computing equipment and associated devices located in its interior. The data center includes computing equipment, an internal network, an external network, power supplies, a lighting system, and a controller. The power supplies and the lighting system connect to the controller, which in turn connects to the internal network. The computing equipment connects to the power supplies. A remote computing device connected to the external network communicates with the controller through the internal network. The remote computing device receives information from the controller and instructs the controller to selectively energize and de-energize the power supplies and the lighting system. The controller may have a user interface configured to display data associated with the computing equipment and other devices and systems located within the container.

Data center

A data center inside a shipping container having a lower plenum and an upper plenum in its interior, individual computing devices, and a humidity. Humidity inside the container is controlled by a humidity sensing device that reports the humidity level to a central controller. The central controller is connected to a humidity control device and the individual computing devices. Based on the humidity level, the central controller will adjust the output of the humidity control device to maintain the humidity internal to the container at a pre-determined level. The central controller energizes and de-energizes individual computing devices depending on the humidity level inside the container and other factors associated with the operation of computing devices. The central controller is also connected to, and communicates with, an external communication network.

A data center inside a shipping container having a lower plenum and an upper plenum in its interior. Heated air in the upper plenum exits therefrom into a plurality of heat exchangers adjacent thereto. Air cooled by the heat exchangers travels toward and enters the lower plenum. The data center includes a plurality of carriages each having an equipment receiving portion located between an open bottom portion in open communication with the lower plenum, and an open top portion in open communication with the upper plenum. Fans inside each of the carriages draw cooled air up from the lower plenum into the open bottom portion of the carriage, blow the cooled air up through the equipment receiving portion thereby cooling any computing equipment received therein, and vent the cooled air through the open top portion into the upper plenum.

Systems and methods for cooling computer components in large computer systems are disclosed herein. In one embodiment, a computer system configured in accordance with aspects of the invention can include a computer module positioned in a chassis, and an air mover configured to move air through the chassis and past the computer module. The computer system can further include a pressure sensor operably coupled to the air mover. If the pressure sensor determines that the difference between a first air pressure inside the chassis and a second air pressure outside the chassis is less than a preselected pressure, the air mover can increase the flow of air through the chassis and past the computer module.

Systems and methods for cooling computer modules in computer cabinets

Structures and methods for positioning heat sinks in contact with electronic devices are described herein. In one embodiment, a structure for holding a heat sink in contact with an electronic device in accordance with one aspect of the invention includes an electronic device holding portion and a heat sink holding portion. The electronic device holding portion is configured to support the electronic device. The heat sink holding portion is configured to position the heat sink in contact with the electronic device. The structure further includes a spring holding portion configured to support a coil spring in transverse compression. When transversely compressed, the coil spring presses the heat sink against the electronic device with a uniform, or at least approximately uniform, pressure that enables the heat sink to efficiently conduct heat away from the electronic device without damaging the device.

Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses

Alignment mark for placement of guide hole

The flexible connector for high density circuit applications comprises a multilayer flexible substrate upon which are formed a plurality of contact pads, in a density required by a particular application. This density may exceed two hundred contact pads per square inch. Contact pads of similar size and configuration are formed on the surface of another device, i.e., circuit board, and provision made to align the contact pads of the connector with those of the circuit board. Micro-pads are formed on the surface of the contact pads on the connector such, that when the connector is brought into contact with the circuit board, and sufficient pressure is applied, the micro-pads make actual electrical contact with the pads of the circuit board. Since the total surface area in contact, namely the sum of the surface areas of the micro-pads, is a small fraction of the total area of the connector, a large pressure is provided at the electrical contact interface even when low pressure is provided to the connector as a whole.

Flexible connector for high density circuit applications

A clock distribution tree for use with a semiconductor chip. The package for a semiconductor chip includes a clock distribution tree having a plurality of output terminals for connection to a plurality of input pads on a semiconductor chip. According to one embodiment, the semiconductor chip includes a clock receiving and conditioning circuit which is coupled to a clock input signal line. The clock receiving and conditioning circuit receives a clock signal, filters it, amplifies it and outputs it back to the package having a clock distribution tree thereon. The clock distribution tree thereafter distributes the clock signal to the appropriate locations of the semiconductor chip through clock output terminals coupled to clock input paths on the semiconductor chip.

Method and apparatus for providing a clock signal to a semiconductor chip

A connector assembly for connecting the circuit paths on a printed circuit board to another printed circuit board. A casing has a flexible electrical connector positioned under it and coupled to a plurality of electrodes. The flexible electrical connector has conductive traces thereon. The flexible electrical connector extends around the casing, enters the top of the casing and terminates on electrodes in an intermediate circuit board. Individual shuttle flex strips are coupled to the intermediate circuit board and have traces thereon that are coupled to electrodes of the intermediate circuit board. The shuttle flex strips are coupled to a plurality of shuttles that can be moved forward to engage conductive pins in a receiver housing positioned on a second circuit board. In this way, the signal paths from one circuit board are coupled to another circuit board.

Electrical connector assembly for printed circuit boards

A preset bend resulting in a strain relief in a flexible conductor strip that interconnects relatively displaceable first and second electrical contacts that are originally relatively oriented in first spaced apart positions and moveable to second more distantly spaced apart positions. The preset bend includes a substantially straight first leg extending substantially perpendicularly to an axis of relative motion between the first and second interconnected electrical contacts and feeding into a substantially hemi-circular- curve, which continues into a second leg extending toward the second electrical contacts in their spaced apart position.

Growing community of inventors

Bainbridge Island, WA, United States of America

Stephen V R Hellriegel