Applied Materials, Inc.

Stephen Thomas Cormier

Jeonghoon Oh

Jamie Leighton

John Anthony Garcia

Manoj Balakumar

Nick Joseph Jackson

Nandkishore Patidar

Ashish Bhushan

Embodiments of the present disclosure generally relate to chemical mechanical polishing systems (CMP) systems and processes used in the manufacturing of electronic devices. In particular, embodiments herein relate to methods of detecting non-conforming substrate processing events during a polishing process. In one embodiment, a method of processing a substrate on a polishing system includes urging a surface of a silicon carbide substrate against a polishing pad in the presence of a polishing fluid, determining a temperature of the polishing pad using a temperature sensor that is positioned above the platen, monitoring the temperature of the polishing pad, and, if the change in polishing pad temperature reaches a threshold value, initiating a response using a controller of the polishing system.

Methods of detecting non-conforming substrate processing events during chemical mechanical polishing

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Leominster, MA, United States of America

Stephen Thomas Cormier