Solarlego Inc.

Gan Systems Inc.

Fultec Semiconductor, Inc.

Stephen S Coates

Francois Hebert

Greg P Klowak

Ahmad Mizan

Richard A Harris

Cameron Mcknight-Macneil

Techniques for connecting a plurality of solar rechargeable batteries in a planar arrangement or vertical arrangement are disclosed, wherein the plurality of solar rechargeable batteries are electrically connected, wherein each of the plurality of solar rechargeable batteries includes an integrated solar cell and a plurality of interconnections for electrically connecting with the plurality of solar rechargeable batteries in series and in parallel, and wherein the plurality of interconnections include a combination of male and female connectors that allow for electrically connecting the plurality of solar rechargeable batteries in series and in parallel; determining whether the plurality of solar rechargeable batteries are connected in series or in parallel; balancing the load of the plurality of solar rechargeable batteries so that each of the plurality of solar rechargeable batteries is equally charged; and wherein each of the plurality of solar rechargeable batteries can be connected standalone to an electrically powered device to power the electrically powered device.

Interconnecting solar rechargeable batteries in a planar or vertical arrangement

Packaging solutions for devices and systems comprising lateral GaN power transistors are disclosed, including components of a packaging assembly, a semiconductor device structure, and a method of fabrication thereof. In the packaging assembly, a GaN die, comprising one or more lateral GaN power transistors, is sandwiched between first and second leadframe layers, and interconnected using low inductance interconnections, without wirebonding. For thermal dissipation, the dual leadframe package assembly can be configured for either front-side or back-side cooling. Preferred embodiments facilitate alignment and registration of high current/low inductance interconnects for lateral GaN devices, in which contact areas or pads for source, drain and gate contacts are provided on the front-side of the GaN die. By eliminating wirebonding, and using low inductance interconnections with high electrical and thermal conductivity, PQFN technology can be adapted for packaging GaN die comprising one or more lateral GaN power transistors.

Packaging solutions for devices and systems comprising lateral GaN power transistors

Portable stackable solar batteries are disclosed, in which the solar batteries can be connected in a planar arrangement for solar recharging and connected in a vertically stacked arrangement for powering an electrically powered device and/or for charging another rechargeable battery.

Interconnecting solar rechargeable batteries

Portable stackable solar batteries

An apparatus and method for temperature-dependent transient blocking employing a transient blocking unit (TBU) that uses at least one depletion mode n-channel device interconnected with at least one depletion mode p-channel device. The interconnection is performed such that a transient alters a bias voltage Vof the p-channel device and a bias voltage Vof the n-channel device in concert to effectuate their mutual switch off to block the transient. The apparatus has a temperature control unit that is in communication with the TBU and adjusts at least one of the bias voltages V, Vin response to a sensed temperature T, thereby enabling the apparatus to also respond to over-temperature. In some embodiments the p-channel device is replaced with a positive temperature coefficient thermistor (PTC). The temperature control unit can use any suitable circuit element, including, among other a PTC, resistor, negative temperature coefficient element, positive temperature coefficient element, transistor, diode.

Growing community of inventors

San Francisco, CA, United States of America

Stephen S Coates