3d Systems, Inc.

Henkel IP Holding Gmbh

Stephen Ruatta

John S Stockwell

Pingyong Xu

Kris A Schmidt

Kenneth J Newell

Vu A Doan

Khalil M Moussa

Jon Jody Fong

Qizhuo Zhuo

Raymond Mathew Soliz

Elizabeth Hoang

Gyanendra Dutt

A semiconductor assembly comprises a semiconductor wafer, an adhesive coating disposed on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The assembly is prepared by the method comprising (a) providing a semiconductor wafer, (b) disposing a wafer back side coating on the semiconductor wafer, (c) partially curing the wafer back side coating to the extent that it adheres to the back side of the wafer and remains tacky, and (d) contacting the bare dicing tape to the partially cured and tacky wafer back side coating, optionally with heat and pressure.

Wafer back side coating as dicing tape adhesive

The invention relates to a method producing parts using laser sintering wherein a fusible powder is exposed to a plurality of laser scans at controlled energy levels and for time periods to melt and densify the powder and in the substantial absence of particle bonding outside the fusion boundary. Strength is improved up to 100% compared to previous methods. An example includes a relatively high energy initial scan to melt the powder followed by lower energy scans controlled to densify the melt and separated in time to dissipate heat to the surrounding part cake. The rate and extent to which the powder particles are fused together can be controlled so that each successive scan can be used to fuse the particles together in discreet incremental steps. As a result, the final dimensions of the part and its density and mechanical properties can be improved compared to conventional methods and part growth avoided.

Controlled densification of fusible powders in laser sintering

A jettable non-curable support material composition useful for three-dimensional ink jet printing comprising at least one fatty alcohol and at least one abietic rosin ester alcohol, wherein the support material has a melting point between about 50&#xb0; C. to about 65&#xb0; C. and a freezing point between about 45&#xb0; C. to about 55&#xb0; C.

Phase change support material composition

A method for removing supports from a three-dimensional objected formed by selective deposition modeling. The three-dimensional object is formed from a curable phase change material and the supports are formed from a non-curable phase change material. The curable phase change material contains between about 5% to about 25% of a non-reactive wax in order to achieve the desired phase change characteristics of the material. When removing the supports with heat, discoloration undesirably occurs in the three-dimensional object as the non-reactive wax migrates within the object. The method prevents wax migration by cooling the object slowly past the freezing point of the build material such that a temperature differential no greater than about 5&#xb0; C. is present within the object. With the preferred build material having a freezing point of about 49.5&#xb0; C., this is achieved by lowering the temperature between about 62&#xb0; C. to about 52&#xb0; C. over a period of between about 5 to about 10 minutes so that the temperature of the regions of the object remain substantially equal as the freezing point is crossed during cooling.

Post processing three-dimensional objects formed by selective deposition modeling

A method and apparatus for effectively removing gas bubbles in systems fed to ink-jetting devices. The system removes both small and large-scale gas bubbles from systems that feed materials to ink jet print heads.

Gas bubble removal from ink-jet dispensing devices

A method for removing supports from a three-dimensional objected formed by selective deposition modeling. The three-dimensional object is formed from a curable phase change material and the supports are formed from a non-curable phase change material. The curable phase change material contains between about 5% to about 25% of a non-reactive wax in order to achieve the desired phase change characteristics of the material. When removing the supports with heat, discoloration undesirably occurs in the three-dimensional object as the non-reactive wax migrates within the object. The method prevents wax migration by cooling the object slowly past the freezing point of the build material such that a temperature differential no greater than about 5&deg; C. is present within the object. With the preferred build material having a freezing point of about 49.5&deg; C., this is achieved by lowering the temperature between about 62&deg; C. to about 52&deg; C. over a period of between about 5 to about 10 minutes so that the temperature of the regions of the object remain substantially equal as the freezing point is crossed during cooling.

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South Pasadena, CA, United States of America

Stephen Ruatta