International Business Machines Corporation

Silicon Valley Group, Inc.

Stephen Roux

Peter Alfred Gruber

Carlos Juan Sambucetti

James L Speidell

David Hirsch Danovitch

Rajesh S Patel

Daniel George Berger

Guy Paul Brouillette

Steven Alan Cordes

Egon Max Kummer

Santiago E Del Puerto

Eric Brian Catey

David Hult

A precise volume, precisely registerable carrier is provided for use with injection molding for producing integrated circuit bump contacts in the &ldquo;flip chip&rdquo; technology. A hemispherical cavity is produced by etching through and undercutting a registered opening into a transparent carrier. The hemispherical cavity has related specific volume and visible peripheral shape that permits simple optical quality control when the injection molding operation has filled the cavity and simple optical registration for fusing to the pads on the integrated circuit.

Etched glass solder bump transfer for flip chip integrated circuit devices

A removable cover for protecting a reticle used in a lithography system is described. The removable cover includes a frame and a membrane supported by the frame. The membrane is transparent to an inspection wavelength such that the reticle can be inspected with the removable cover in place. This removable cover protects the reticle when the removable cover is in place and is removable for lithographic exposure. The removable cover can further include at least one reticle fastener that applies force to the reticle thereby preventing movement of the removable cover relative to the reticle when the removable cover is in place. A plurality of fasteners are used to position and secure the removable cover and reticle. A method of performing lithography and a lithographic system are also described.

Removable cover for protecting a reticle, system including and method of using the same

A method for forming solder bumps on an electronic structure including the steps of first providing a mold made by a sheet of a mold material having a thickness greater than that of the solder bumps to be formed, the mold material has sufficient optical transparency so as to allow the inspection of a solder material subsequently filled into the mold cavities that are formed in the mold material, and a coefficient of thermal expansion that is substantially similar to the substrate which the mold will be mated to, forming a multiplicity of mold cavities in the sheet of mold material, filling the multiplicity of mold cavities with a solder material, cooling the mold to a temperature that is sufficient to solidify the solder material in the multiplicity of mold cavities, positioning the mold intimately with the electronic structure such that the cavities facing the structure, and heating the mold and the structure together to a temperature sufficiently high such that the solder material transfers onto the electronic structure.

Method for building interconnect structures by injection molded solder

A precise volume, precisely registerable carrier is provided for use with injection molding for producing integrated circuit bump contacts in the 'flip chip' technology. A hemispherical cavity is produced by etching through and undercutting a registered opening into a transparent carrier. The hemispherical cavity has related specific volume and visible peripheral shape that permits simple optical quality control when the injection molding operation has filled the cavity and simple optical registration for fusing to the pads on the integrated circuit.

Etched glass solder bump transfer for flip chip integrated circuit

Growing community of inventors

Purdys, NY, United States of America

Stephen Roux