Northrop Grumman Systems Corporation

Other

US Government As Represented by the Secretary of the Army

Westinghouse Electric Corporation

Norhtrop Grumman Corporation

Northrop Grumman Cropration

Stephen R Gurkovich

Kenneth C Radford

Deborah P Partlow

Andrew J Piloto

Alex E Bailey

Lyon Mandelcorn

Theodore R Vasilow

Robert L Miller

James F Roach

Eugene R Danielson

John Bowers

There is disclosed herein a high voltage and high temperature power electronics capacitor which comprises one or more insulator layers of mica paper, and one or more metal conductor layers, all dispersed in a pressurized environment of a nonreactive and high voltage strength gas maintained at near ambient to about 405.2 kPa of pressure. The insulator and conductor layers are isolated and separated from one another by the alternating placement of conductor layers between said insulator layers. These capacitors are readily packaged for commercial use in containers or housings of almost any geometric form and any material of construction. Moreover, low inductance ceramic bushings can be employed on these containers for establishing external electrical contacts. These capacitors can be economically manufactured and used in large commercial volumes with currently available materials and production methods.

Method of making a power electronics capacitor

A capacitor module having a solid dielectric is cleared in a gaseous environment having an electric strength greater than that of air at a pressure of one atmosphere. A plurality of such cleared capacitor modules is formed into a stack which itself is then cleared by the same clearing process. During intended operation in an electric circuit, the capacitor arrangement would be maintained in such gaseous environment having an electric strength greater than that of air at a pressure of one atmosphere.

Capacitor arrangement and method of stabilizing same

We disclose a fabrication method for integrating passive devices such as capacitors, resistors and circulators into ceramic packages for electronic systems. The method utilizes a glass or glass/ceramic as a bonding agent which is incorporated as one of the layers in the multilayer package. The integration of such passive devices eliminates the tedious mounting of these devices on the package, permitting a smaller, more reliable, less expensive and lighter weight product. This method allows the integration of passive devices having firing temperatures far different from that of the ceramic package itself, permitting combinations of materials that cannot be densified, or cofired together.

Post-firing method for integrating passive devices into ceramic

The invention provides for an electronic package having a buried passive component such as a capacitor therein, and a method for fabricating the same. The electronic package preferably includes a passive component portion which includes a plurality of layers of high K dielectric material, a signal processing portion which includes a plurality of layers of low K dielectric material, and at least one buffer layer interposed between the passive component portion and the signal processing portion. Metallization is preferably printed upon at least one of the layers of high K dielectric material and at least one of the layers of low K dielectric material. Preferably, the layers are co-fired at a temperature below approximately 1200.degree. C. to form the electronic package and each of the buffer layers contains approximately 25 to 100% barium compound. Via conductors may also be provided through the buffer layers to electrically couple the passive component portion and the signal processing portion and the metallization and the via conductors may be selected from highly conductive materials such as gold, silver, copper and alloys thereof.

Electronic package having buried passive components

A method for forming a low temperature cofired ceramic package which is made using a multi-layered densified spherical powder formed via a sol-gel process. This densified powder is formed from layers of SiO.sub.2 reacted with trimethyl borate. The spherical powder has a preselected particle size and boron content sufficient to render the low temperature cofired ceramic package fully dense, even in the presence of a second phase filler ceramic, at a sintering temperature below 1000.degree. C. Binder material is added to the spherical powder and ceramic filler to form a plurality of tapes. A ceramic assembly is then formed by layering the plurality of tapes upon one another and firing the ceramic assembly at a temperature below 1025.degree. C. to form a fully dense cofired ceramic package. In order to form the multi-layered densified spherical powder, a silica core, which is formed using a sol-gel process, is reacted with trimethyl borate. An additional layer of silica is provided upon the reacted product which, in turn, is reacted with trimethyl borate. This process is continued until a spherical powder of desired size is formed.

Method for manufacturing a low loss, low temperature cofired ceramic

A ceramic capacitor suitable for high energy density and high temperature application is disclosed. Such a capacitor is prepared by producing the selected ceramic powder via the sol-gel process forming the capacitor to the desired shape with the resulting powder using tape casting technology and firing the 'green' form so produced.

High power capacitor

A multi-layer capacitor comprising a stack of sheet electrodes with an insulating dielectric layer sandwiched between these layers is disclosed. The dielectric layer formed on the electrode is prepared by the 'sol-gel' process.

High capacitance thin film capacitor

A wound thin film capacitor is formed by the method of applying a solution of a metal-organic alkoxide composition to at least one flat surface of an electrically conductive metal strip and heating the coated strip so as to remove the organic component of the metal-organic alkoxide composition and produce a thin, electrically non-conductive metal oxide film on the flat surface. The metal strip with the metal oxide coating is then wound on a spool to form a wound thin film capacitor.

Growing community of inventors

Pittsburgh, PA, United States of America

Stephen R Gurkovich