International Business Machines Corporation

Stephen R Engle

Timothy F Carden

Kishor V Desai

Randall Joseph Stutzman

George Henry Thiel

Scott Preston Moore

Glenn O Dearing

James Warren Wilson

Joseph G Ameen

Ronald J Moore

Mukund Kantilal Saraiya

Lawrence Richard Cutting

A chip carrier package that includes a cover plate attached to the stiffener by a reflowable bonding material is disclosed. Additionally, a thermally and electrically conductive bonding material between the cover plate and the chip itself may be included. Also a chip package including an alignment device to aid in properly aligning the cover plate on the stiffener is disclosed. Furthermore, a method of packaging a chip including providing a reflowable material between the cover plate and stiffener body for attaching the cover plate to the stiffener, and simultaneously attaching the cover plate to the stiffener with an attaching of the carrier to an electronic circuit board is disclosed.

Method of packaging a high performance chip

A chip carrier package that includes a cover plate attached to the stiffener by a reflowable bonding material is disclosed. Additionally, a thermally and electrically conductive bonding material between the cover plate and the chip itself may be included. Also a chip package including an alignment device to aid in properly aligning the cover plate on the stiffener. Furthermore, a method of packaging a chip including providing a reflowable material between the cover plate and stiffener body for attaching the cover plate to the stiffener, and simultaneously attaching the cover plate to the stiffener with an attaching of the carrier to an electronic circuit board.

High performance chip packaging and method

A thermally enhanced ball grid array package for electronic components, with an electronic and a plurality of ceramic component carriers bonded to a metal heat sink, enhances thermal performance, reduces solder ball fatigue and reduces stresses between the ceramic component carriers and the heat sink. Bonding the ceramic component carriers to the heat sink reduces expansion induced stresses of the solder balls on the carriers. Plural ceramic component carriers, smaller than a single carrier would have to be for the same package, reduce stresses at the interfaces between the ceramic component carriers and the heat sink.

Thermally enhanced ball grid array package

A ceramic chip carrier is disclosed which includes a ceramic substrate having a circuitized surface, at least one semiconductor chip mounted on the circuitized surface, and a lead frame or edge clip which is mechanically and electrically connected to contact pads on the circuitized surface. Each mechanical/electrical connection between the lead frame or edge clip and the contact pads includes a conventional solder connection. In addition, each such solder connection is at least partially encapsulated in a material, including an epoxy resin, which is chosen in relation to the solder connection to enable the solder connection to withstand a standard thermal fatigue test.

Ceramic chip carrier with lead frame or edge clip

A suspension of a coating material having hydrogen bonds and pre-determined physical and chemical characteristics in a predominantly solid state in a polar solvent that is capable of breaking the hydrogen bonds and providing the material in a liquid form and use of the suspension to provide substantially uniform conformal layer of material onto a workpiece by applying the suspension to a workpiece and then evaporating the polar organic solvent so that the coating material is provided in its predominantly solid state having substantially the predetermined physicall and chemical characteristics.

Growing community of inventors

Binghamton, NY, United States of America

Stephen R Engle