British Telecommunications Corporation

Stephen P Rogerson

Brian M MacDonald

A method of mounting a saw device comprising applying metallized areas to the surface of an appropriate substrate, attaching conductive leads to the metallized areas, locating the said surface adjacent a selected area of another substrate so that said leads contact conductive regions on the second substrate and attaching said leads to said conductive regions on the second substrate so that the first substrate is supported on the leads and the conductive regions.

Method of mounting saw devices

A SAW device is formed by applying metallized areas (11) to a surface of a SAW substrate (10) and attaching conductive leads (18) to the metallized areas. The substrate is inverted and located on a hybrid circuit so that the leads (18) contact and are supported on conductive areas (30) of the circuit. This mounting arrangement minimizes the stresses which occur in the substrate in its operational life. A novel shape for the device is also disclosed.

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Woodbridge, United Kingdom

Stephen P Rogerson