Motorola Corporation

Stephen P Rogers

Michael S Lebby

Brian A Webb

Chowdary Ramesh Koripella

Dominic Francis Gervasio

Christopher K Dyer

Song Q Shi

Franky So

William J Ooms

Jonathan K Abrokwah

Curtis D Moyer

Majid M Hashemi

David Wilcox

Matthew Kim

A hydrogen generator including a three-dimensional multilayer ceramic carrier structure defining a fuel reformer. The reformer includes a vaporization zone and a reaction zone including a catalyst. The reformer is operational as either a steam reformer, a partial oxidation reformer or an autothermal reformer. The fuel reformer, or processor, further includes an inlet channel for liquid fuel and an outlet channel for hydrogen enriched gas. The fuel processor is formed utilizing multi-layer ceramic technology in which thin ceramic layers are assembled then sintered to provide miniature dimensions in which the encapsulated catalyst converts or reforms inlet fuel into a hydrogen enriched gas.

Hydrogen generator utilizing ceramic technology

A fuel processor and integrated fuel cell including a monolithic three-dimensional multilayer ceramic carrier structure defining a fuel reformer and including an integrated fuel cell stack. The reformer includes a vaporization zone, a reaction zone including a catalyst, and an integrated heater. The integrated heater is thermally coupled to the reaction zone. The fuel processor further includes an inlet channel for liquid fuel and an outlet channel for hydrogen enriched gas. The fuel processor is formed utilizing multi-layer ceramic technology in which thin ceramic layers are assembled then sintered to provide miniature dimensions in which the encapsulated catalyst converts or reforms inlet fuel into a hydrogen enriched gas.

Fuel processor with integrated fuel cell utilizing ceramic technology

Electroluminescent apparatus comprising an organic electroluminescent device having an active organic region, an inert fluorocarbon liquid layer covering substantially the active organic region, and an epoxy layer encapsulating substantially the inert fluorocarbon liquid layer and the active organic region.

Organic EL device with fluorocarbon liquid and UV epoxy layers and method

Packaged electroluminescent apparatus including an organic electroluminescent device carried by a glass substrate and a glass cover sealed with the glass substrate at a perimeter seal bounding the organic electroluminescent device in a cavity. Wherein the perimeter seal includes a cured epoxy adhesive seal sealingly engaging the glass cover with the glass substrate, and desiccant and/or inert fluorocarbon liquid disposed proximate the cured epoxy adhesive.

Electroluminescent apparatus and methods of manufacturing and

A method of encapsulating organic electroluminescent (EL) devices including providing an EL device on a substrate and a metallic sheet having a stand-off structure depending therefrom, the stand-off structure bounding a cavity larger than the EL device. The stand-off structure is positioned over the EL device with the EL device nested within the cavity. The metallic sheet is adhesively bonded to the substrate at a perimeter outboard of the stand-off structure to seal the organic electroluminescent device in the cavity. When a plurality of EL devices are manufactured on a single substrate, the metallic sheet is perforated at the perimeter of each device so that excess metal can be separated and the substrate separated to provide individual EL devices.

Methods of encapsulating electroluminescent apparatus

An organic electroluminescent device encapsulating package including a substrate, an organic electroluminescent device carried by the substrate, an inorganic perimetric seal carried by the substrate, the perimetric seal encircling the organic electroluminescent device within a perimeter thereof, and an inorganic cover overlying the organic electroluminescent device and sealingly coupled to the substrate in a spaced apart relationship by the inorganic perimetric seal.

Organic electroluminescent device hermetic encapsulation package and

An organic electroluminescent device array encapsulating package including an organic electroluminescent device on a supporting substrate. A cover having a rim engaging the supporting substrate is spaced from and hermetically encloses the organic electroluminescent device. A dielectric liquid having benign chemical properties fills the space between the cover and the organic electroluminescent device, providing both an efficient medium for heat transmission and an effective barrier to oxygen and moisture.

Organic electroluminescent device hermetic encapsulation package

A layer is plasma etched or deposited with a gaseous mixture of a hydrocarbon, hydrogen and a noble gas. A cathode DC bias of greater than 600 V is used. This cathode DC bias allows for selectively etching a III-V material over an aluminum containing layer or for the deposition of a hydrogenated carbon film.

Selective processing using a hydrocarbon and hydrogen

A method for making an electron emissive film is provided. A substrate and a reaction chamber having a temperature and a pressure is provided. The temperature and the pressure are adjusted to a desired temperature and a desired pressure. A substrate is place into the reaction chamber with hydrocarbon gas being flowed into the chamber. A plasma is ignited in the reaction chamber so as to form a tetrahedral shaped compound in the reaction chamber which aids in deposition of an electron emissive material on the substrate.

Electron emissive film

A method for plasma etching semiconducting composed of III-V and related materials is provided. Enhanced removal rates, greater volatility, and reduced etch initiation time is provided by exposing the semiconductor to a plasma of methane, hydrogen, and at least one of trialkylboron, trimethylboron, or triethylboron.

Etching of materials in a noncorrosive environment

A method for making a self-aligned IID structure for an LED (10) is provided. This self-aligned IID structure is accomplished by depositing a dopant layer (17) over the LED structure. A polymeric material is deposited over layer (17). The polymeric layer and dopant containing layer (17) are etched to a predetermined position. The remaining polymeric material is removed from the LED (10) structure. The LED (10) structure is annealed to produce an IID structure by laterally diffusing dopants from layer (17) into at least one side wall of the LED (10).

Method for making a self-aligned impurity induced disordered structure

A method for plasma etching semiconductor materials using silicon tetrachloride and boron trichloride is provided. Less etch damage, a greater degree of anisotropy and a more controlled etch is provided by exposing a III-V compound semiconductor to the novel gas mixture.

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Phoenix, AZ, United States of America

Stephen P Rogers