British Aerospace Public Limited Company

Stephen P Lake

Alan P Pritchard

Ian Michael Sturland

A thermal picture synthesis device (1) of multi-layer construction has a resistor element (3) spaced from a semi-conductor substrate layer (2). The resistor element (3) is made of titanium or Ni-chrome. A drive element layer (4) is provided either in or attached to the substrate layer (2) for the resistor element (3). By placing the drive element layer parallel to and spaced from the resistor element (3) it is possible to pack a plurality of resistor elements (3) into a side by side adjacent array with a high fill factor or packing density and this coupled with the use of titanium or Ni-chrome for the resistor elements (3) and the spacing of these elements from the semi-conductor substrate (2) allows the device to operate at a higher apparent temperature than is conventional.

Thermal picture synthesizer device for generating a thermal image

A method of forming through-holes in a multi-level interconnect system in which a layer of photo-resist is spun over a masking layer prior to mask-etching so that when the photo-resist is exposed and developed some remains in the bottom of through holes formed in the surface layer so as to protect the base layer from the mask-etching agent.

Growing community of inventors

Bristol, United Kingdom

Stephen P Lake