Purdue Research Foundation

Arizona Board of Regents, a Body Corporate

Stephen P Beaudoin

Bryan William Boudouris

Michelle Chaffee-Cipich

Myles Calvin Thomas

Lizbeth Rostro

Stefan Lukow

Caitlin Joy Schram

Aaron James Harrison

Kathryn Maureen Smith

A novel, advanced polymeric swab is disclosed herein. The swabs have a surface texture that allows for independent motion between microscale regions, are reusable with no loss of accuracy or efficiency, and are fabricated from optoelectronically-active elements to minimize static charging during repeated use.

Engineered detection swab

In a slurry solution for chemical mechanical planarization (CMP) of a semiconductor wafer, an abrasive particle is provided having a central body and a plurality of extensions from the central body of the abrasive particle. The plurality of extension hold a center of mass of the abrasive particle a distance from the semiconductor wafer during the CMP process. The extensions extend 3-dimensionally from the central body, with the length of one extension being about 30 nm. The extensions reduce attractive forces acting on the central body allowing the abrasive particles to be removed from the semiconductor wafer during a post-CMP cleaning process.

Abrasive particles to clean semiconductor wafers during chemical mechanical planarization

Growing community of inventors

West Lafayette, IN, United States of America

Stephen P Beaudoin