International Rectifier Corporation

Stephen Oliver

Hugh D Richard

Mario Battello

Mark Pavier

Ajit Dubhashi

Marco Soldano

Glyn Connah

An inverter for driving a motor includes one or more power stages for producing one or more power signals for energizing the motor, each power stage including first and second III-nitride based bi-directional switching devices connected in series between a DC voltage bus and ground.

Motor drive based on III-nitride devices

Motor drive inverter that includes III-nitride based power semiconductor devices

A copackaged electronic device comprises a diode device having an anode coupled to a drain electrode of a switching device and a cathode capable of being coupled to an external circuit. The switching device may be controlled by an integrated circuit mounted on a source electrode of the switching device and electrically connected such that the integrated circuit is capable of controlling switching of the switching device. For example, the device is used in a power factor correction circuit. The diode device comprises at least one inverted diode having a solderable anode and a wire-bondable cathode.

Co-packaged control circuit, transistor and inverted diode

A low profile semiconductor device package includes a lead frame with terminal leads and two die pads for receiving at least two semiconductor die that are interconnected to form a circuit. A further low profile semiconductor device package includes a lead frame with two die pads for receiving at least two semiconductor die that are interconnected to form a circuit and also has a reduced height through removal of a mounting tab. An example of such device packages is a package that includes first and second MOSFET die, each connected to a respective die pad. The source of one MOSFET is connected to the drain of the other MOSFET, thereby forming a low profile device package that provides a half-bridge circuit. Other example device packages include different arrangements of two interconnected MOSFET die, two interconnected IGBTs, or a combination of a MOSFET die and a diode.

Low profile package having multiple die

Two series-connected diodes which are housed in a power package (such as but not limited to TO220, TO220FP, D2pak, TO247, etc.).

Growing community of inventors

Redondo Beach, CA, United States of America

Stephen Oliver