Analog Devices International Unlimited Company

Analog Devices Global

Analog Devices Global Unlimited Company

Other

Analog Devices,inc.

Stephen O'Brien

Bernard Patrick Stenson

Laurence Brendan O'Sullivan

Paul Martin Lambkin

Shane Patrick Geary

Baoxing Chen

Patrick Martin McGuinness

Sombel Diaham

Patrick J Murphy

Jochen Schmitt

Matthew Thomas Canty

William Allan Lane

Michael C Coln

Jan Kubik

John O'Dowd

Peter James Tonge

Monsoon Dutt

Robert Guyol

Enda Joseph Nicholl

Christina B McLoughlin

Brian O'Mara

Wenmei Wang

Aude Richard

Christophe Antoine

Michael Mueller-Aulmann

Daniel Joseph Lucey

Colin P Giles

Sarah Carroll

Christian Nau

Conor John Mcloughlin

Michael W Judy

Michael Noel Morrissey

Michael John Flynn

Enno Lage

Shane Geary

Mark Daniel De Leon Alea

Himanshu Jain

Sinead Maire McDermott

Mark De Leon Alea

Sinead Maire Mcdermott

Michal J Osiak

Peter Meehan

Patrick M Mcguinness

Laurence B O'SULLIVAN

Embodiments of the disclosure provide various nanogap sensor designs (e.g., horizontal nanogap sensors, vertical nanogap sensors, arrays of multiple nanogap sensors, various arrangements for making electrical connections to the electrodes of nanogap sensors, etc.), as well as various methods which may be used to fabricate at least some of the proposed sensors. The nanogap sensors proposed herein may operate as molecular sensors to help identify chemical species through electrical measurements using at least a pair of electrodes separated by a nanogap.

Designs and fabrication of nanogap sensors

A magnetic sensor package comprising a magnetic multi-turn sensor die and a magnetic single turn sensor die, in which both sensor dies are packaged on the same lead frame. A method of manufacturing the magnetic sensor package is also provided. A magnetic sensor system comprising a rotating magnet and the magnetic sensor package, where the sensor package is arranged so that both sensor dies sit within a homogenous magnetic field, thereby ensuring that the output signal of each sensor is not corrupted by any stray fields.

Magnetic sensor package and magnetic sensing system

A micro-isolator is described. The micro-isolator may include a first isolator element, a second isolator element, and a first dielectric material separating the first isolator element from the second isolator element. A second dielectric material may completely or partly encapsulate the second isolator element, or may be present at outer corners of the second isolator element. The second dielectric material may have a larger bandgap than the first dielectric material, and its configuration may reduce electrostatic charge injection into the first dielectric material. The micro-isolator may be formed using microfabrication techniques.

Insulation jacket for top coil of an isolated transformer

The present disclosure provides a magnetic multi-turn sensor comprising a continuous coil of magnetoresistive elements and a method of manufacturing said sensor. The continuous coil is formed on a substrate such as a silicon wafer that has been fabricated so as to form a trench and bridge arrangement that enables the inner and outer spiral to be connected without interfering with the magnetoresistive elements of the spiral winding in between. Once the substrate has been fabricated with the trench and bridge arrangement, a film of the magnetoresistive material can be deposited to form a continuous coil on the surface of the substrate, wherein a portion of the coil is formed in the trench and a portion of the coil is formed on the bridge.

Magnetic multi-turn sensor and method of manufacture

Micro-isolators exhibiting enhanced isolation breakdown voltage are described. The micro-isolators may include an electrically floating ring surrounding one of the isolator elements of the micro-isolator. The isolator elements may be capacitor plates or coils. The electrically floating ring surrounding one of the isolator elements may reduce the electric field at the outer edge of the isolator element, thereby enhancing the isolation breakdown voltage.

Electric field grading protection design surrounding a galvanic or capacitive isolator

Magnetic sensor package

Isolators having a back-to-back configuration for providing electrical isolation between two circuits are described, in which multiple isolators formed on a single, monolithic substrate are connected in series to achieve a higher amount of electrical isolation for a single substrate than for isolators formed on separate substrates connected in series. Discrete dielectric regions positioned between isolator components forming an isolator provide electrical isolation between the isolator components as well as between the isolators formed on the substrate. The back-to-back isolator may provide one or more communication channels for transfer of information and/or power between different circuits.

Back-to-back isolation circuit

An isolator device is provided comprising a body of first dielectric material between the first and second conductors, such as primary and secondary coils of a micro-transformer. A region of second dielectric material is provided between the body of first dielectric material and at least one of the first and second electrodes, wherein the second dielectric material has a higher relative permittivity than the first dielectric material. This provides enhances ability to withstand the Electric fields generated at the edge of a conductor. The body of the first dielectric can be tapered to provide stress relief to prevent the second dielectric material developing stress cracks.

Dielectric stack, an isolator device and method of forming an isolator device

An isolator device and a corresponding method of forming the isolator device to include first and second electrodes, a layer of first dielectric material between the first and second electrodes, and at least one region of second dielectric material between the layer of first dielectric material and at least one of the first and second electrodes. The second dielectric material has a higher relative permittivity than the first dielectric material.

Isolator and method of forming an isolator

A method of manufacture of a sensor, the method comprising, in a first fabrication facility, forming one or more components of the sensor on a substrate; and in a second fabrication facility depositing a sensor layer, such as a magnetoresistive sensor, onto the substrate or over the one or more components. Otherwise contaminating effects of depositing magnetoresistive materials can thus be confined to the second fabrication facility, permitting more advanced fabrication equipment and techniques to be employed in the first fabrication facility.

Sensor with magnetroesitive and/or thin film element abutting shorting bars and a method of manufacture thereof

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Clarina, Ireland

Stephen O'Brien