Lam Research Corporation

Kateeva, Inc.

Other

Stephen Mark Smith

Alexander Sou-Kang Ko

Randolph E Treur

Shandon Alderson

Robert Dennis Taff

Geoffrey Kenneth Love

Eliyahu Vronsky

Robert B Lowrance

Brian M Bliven

Christopher E Todd

Douglas Grant Gardner

An inkjet printer has a print assembly and a print material feed system comprising a first circulation circuit and a second circulation circuit, the first circulation circuit fluidly coupled between the second circulation circuit and the print assembly.

Print material feed system

A method for printing a substrate may comprise positioning a substrate within an enclosure enclosing a printing system, wherein the printing system comprises a printhead device assembly comprising at least one printhead, and performing a printing process on the substrate. and. The printing process may comprise supplying ink from a local ink dispensing reservoir to the printhead device assembly, the local ink dispensing reservoir located inside the enclosure; supplying ink from a local ink replenishment reservoir to the local ink dispensing reservoir so as to maintain, in the local ink dispensing reservoir, a level of ink within a first predetermined range, the local ink dispensing reservoir located inside the enclosure; supplying ink from a bulk ink delivery system, through a fluid line disposed inside an outer conduit, and to the local ink replenishment reservoir so as to maintain, in the local ink replenishment reservoir, a level of ink within a second predetermined range, the bulk ink delivery system located outside the enclosure; and depositing ink from the at least one printhead on the substrate

Ink delivery systems and methods

For various embodiments of a printhead assembly or ink stick assembly of the present teachings, each an ink stick assembly can be a self-contained assembly, of which a plurality of self-contained ink stick assemblies can be readily interchanged into a printing system during a printing process. Various embodiments of a self-contained ink stick assembly can have a fluidic system that can include a local ink reservoir, which can be in fluid communication with a bulk ink reservoir. Filling of a bulk ink reservoir can be done in a manual or automated mode. According to the present teachings, a bulk ink reservoir can have a volume sufficient to provide a continuous supply of ink to a local ink reservoir over the course of a printing process.

Printing system assemblies and techniques

The present teachings disclose various embodiments of a printing system for printing a substrate, in which the printing system can be housed in a gas enclosure, where the environment within the enclosure can be maintained as a controlled printing environment. A controlled environment of the present teachings can include control of the type of gas environment within the gas enclosure, the size and level particulate matter within the enclosure, control of the temperature within the enclosure and control of lighting. Various embodiments of a printing system of the present teachings can include a bulk ink delivery system that can be external to a gas enclosure. A bulk ink delivery system according to the present teachings can supply ink to a local ink delivery system that is internal to the gas enclosure. Various embodiments of a local ink delivery system of the present teachings can be proximal to a printhead device assembly, and can include a two-stage ink supply having a local ink replenishment reservoir that is configured to supply a local ink dispensing reservoir to a constant volume. According to the present teachings, a local ink dispensing reservoir can be in flow communication with a plurality of printhead devices. As such, a two-stage local ink delivery system maintaining a constant volume in a local ink dispensing reservoir can provide constant head pressure to the plurality of printhead devices.

A method for rinsing a semiconductor wafer in a module utilizing a fluid delivery ring is provided. The method includes providing a process bowl having a generally circular shape bottom wall, a sidewall that extends upwardly from the bottom wall to define a cylindrical chamber, and a plurality of channels in the sidewall that extend from the bottom wall to an upper edge of the sidewall. A fluid delivery ring is attached onto the sidewall of the process bowl. Utilizing the process bowl, a plurality of supply tubes is inserted into the fluid delivery ring. The fluid delivery ring has a plurality of ring inlet and outlet pairs and a plurality of respective slots. Fluid is supplied to the supply tubes, and fluid is directed onto a surface of the semiconductor wafer defined within the process bowl.

Fluid delivery ring and methods for making and implementing the same

A method for spinning a wafer to enable rinsing and drying is provided. The method includes engaging the wafer at a wafer processing plane and spinning the wafer. The method further includes moving a wafer backside plate from a first position to a second position as spinning of the wafer proceeds to an optimum spinning speed. The second position defines a reduced gap between an under surface of the wafer and a top surface of the wafer backside plate. The method also includes repositioning the wafer backside plate from the second position to the first position as the spinning reduces in speed. The first position defines an enlarged gap to enable loading and unloading of the wafer from the engaged position.

Wafer backside plate for use in a spin, rinse, and dry module and methods for making and implementing the same

A fluid delivery module for use in preparing a substrate is provided. The fluid delivery module includes a process bowl designed to contain a substrate to be prepared. The process bowl has a bottom wall and a sidewall. The fluid delivery module further includes a fluid delivery ring configured to be attached to the sidewall of the process bowl. The fluid delivery ring includes a plurality of inlet and outlet pairs. Each of the plurality of inlet and outlet pairs is defined in the fluid ring and is designed to receive a respective supply tube. Each respective supply tube has an end that terminates at each of the outlets of the fluid delivery ring and is configured to direct fluid onto a surface of the substrate.

Methods for making and implementing fluid delivery ring

An apparatus for preparing a wafer is provided. The apparatus includes a wafer backside plate and a central shaft. The wafer backside plate has a top surface that includes a cylindrical edge lip, which defines a central aperture. The central shaft is designed to fit within the central aperture. The wafer backside plate is designed to automatically slide between an up position during rotational wager processing and a down position when the wafer is not in rotational wafer processing. A gap defined between the top surface of the wafer backside plate and the wafer is less when the wafer backside plate is in the up position than when the wafer backside plate is in the down position.

An edge roller assembly includes first and second grip rings. The grip rings are held together in an opposing relationship such that outer surfaces thereof define a groove for receiving an edge of a substrate. The grip rings may be O-rings formed of a rubber material. In one embodiment, the grip rings are held together by lower and upper clamp plates that are adjustably fastened together so that the clamping forces exerted on the substrate can be controlled. The upper clamp plate may have a height adjustment knob for adjusting the height of the edge roller assembly mounted thereon. A method for contacting an edge of a substrate and a transport system for transporting semiconductor wafers to a wafer processing station also are described.

Edge roller assembly, method for contacting an edge of a substrate, and transport system for transporting semiconductor wafers to a wafer processing station

A chuck assembly for use in a substrate spin, rinse, and dry (SRD) module is provided. The chuck assembly includes a wedge, a chuck body, and a plurality of grippers. The wedge has a sidewall and is designed to move from a lower position to an upper position and from the upper position to the lower position thus opening and closing the chuck assembly, respectively. The chuck body has a cylindrical shape and is designed to include a plurality of linkage arms. The chuck body is designed to enclose the wedge such that each linkage arm is substantially in contact with the sidewall of the wedge. The cylindrical shape of the chuck body is designed to reduce air disturbance around a surface of a substrate. The plurality of grippers are designed to be coupled to the chuck body via a plurality of rotation pins. Each of the grippers is configured to stand substantially upright so as to engage the substrate when the wedge is in a lower position, and each of the grippers is configured to lie substantially flat so as to disengage the substrate when the wedge is in the lower position.

Chuck assembly for use in a spin, rinse, and dry module and methods for making and implementing the same

An apparatus for electronically measuring a foot size including a tracing device for electronically tracing an outline of a consumer's foot, a data processing device for receiving measured foot outline data and for translating the foot outline data into a foot size, and a display device for displaying the foot size and foot outline data. A method for electronically measuring a foot size of a foot placed on a flat surface, including tracing a foot outline with a tracing device, transferring foot outline data to a data processing device, translating the foot outline data into a shoe size and displaying the shoe size and foot outline data.

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Morgan Hill, CA, United States of America

Stephen Mark Smith